Application of electronic speckle-pattern interferometry to measure in-plane thermal displacement in flip-chip packages

Electronic speckle-pattern interferometry (ESPI) was applied for noncontact, real-time evaluation of thermal deformation in a flip-chip package. The spatial resolution of ESPI was increased to submicron scale by magnifying the areas studied in order to measure the deformation of such small-scale com...

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Veröffentlicht in:	Materials science & engineering. A, Structural materials : properties, microstructure and processing Structural materials : properties, microstructure and processing, 2004-08, Vol.380 (1), p.231-236
Hauptverfasser:	Lee, Baik-Woo, Jang, Woosoon, Kim, Dong-Won, Jeong, Jeung-hyun, Nah, Jae-Woong, Paik, Kyung-Wook, Kwon, Dongil
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Coefficient of thermal expansion (CTE) Electronic speckle-pattern interferometry (ESPI) Electronics Exact sciences and technology Finite-element analysis (FEA) Flip-chip package Microelectronic fabrication (materials and surfaces technology) Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Shear strain
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