Recovery of microstructure and surface topography of grinding-damaged silicon wafers by nanosecond-pulsed laser irradiation

Single crystalline silicon wafers whose surfaces were machined by diamond grinding were irradiated by a nanosecond-pulsed Nd:YAG laser. Changes in the subsurface crystallinity and surface topography were investigated by transmission electron microscopy and atomic force microscopy. It was found that...

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Veröffentlicht in:	Semiconductor science and technology 2009-10, Vol.24 (10), p.105018-105018 (6)
Hauptverfasser:	Yan, Jiwang, Sakai, Shin, Isogai, Hiromichi, Izunome, Koji
Format:	Artikel
Sprache:	eng
Schlagworte:	Condensed matter: structure, mechanical and thermal properties Cross-disciplinary physics: materials science rheology Exact sciences and technology Materials science Physics Solid surfaces and solid-solid interfaces Surface structure and topography Surface treatments Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties)
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