Electrodeposition of Sn-Ag Alloys and Its Connecting Reliability for Automotive Connectors

Electrodeposition behavior of Sn-Ag alloys was investigated at 1 to 1000 A/m2 in both sulfate and pyrophosphate-iodide baths of 298 K, and the contact resistance of Sn-Ag alloys deposited on Cu connector was evaluated. In both baths, Ag behaved as more noble metal than Sn, showing the typical featur...

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Veröffentlicht in:	Journal of the Japan Institute of Metals and Materials 2009, Vol.73(8), pp.622-629
Hauptverfasser:	Nakano, Hiroaki, Oue, Satoshi, Uranaka, Masaaki, Masuda, Masataka, Fukushima, Hisaaki, Saka, Yoshifumi, Sawada, Shigeru, Hattori, Yasuhiro
Format:	Artikel
Sprache:	eng ; jpn
Schlagworte:	Binary alloys Binary systems Codeposition connecting reliability connector Connectors Contact resistance Copper Electrodeposition Metal compounds Noble metals Phase diagrams Reliability Silver Tin Tin base alloys Tin compounds Tin plating tin-silver alloys
Online-Zugang:	Volltext
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