Aggregation in thin-film silver: Induced by chlorine and inhibited by alloying with two dopants
The Ag aggregation mechanism triggered by chlorine (Cl) is discussed. The frontier orbital theory by K. Fukui is applied in order to determine the growing point in the silver (Ag) cluster. Ag in the thin-film silver would grow to Ag n Cl and stack, triggered by Cl from the outside according to the m...
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| Veröffentlicht in: | Corrosion science 2009-11, Vol.51 (11), p.2557-2564 |
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| container_title | Corrosion science |
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| creator | Koike, Katsuhiko Shimada, Koichi Fukuda, Shin |
| description | The Ag aggregation mechanism triggered by chlorine (Cl) is discussed. The frontier orbital theory by K. Fukui is applied in order to determine the growing point in the silver (Ag) cluster. Ag in the thin-film silver would grow to Ag
n
Cl and stack, triggered by Cl from the outside according to the mechanism described. This would lead to an aggregate with a high Ag density. It is suggested that this would be the generating mechanism of the silver-gray aggregate consisting mostly of Ag, which is generated by exposing it to Cl.
Two tactics in order to prevent restrain aggregation induced by Cl according to the mechanism are proposed. Tactic 1 is a restraining of structure change to a plane in the process of Ag
6Cl
+
Ag
→
Ag
7Cl. Tactic 2 is the trapping of Cl before it generates a bond to Ag.
The ability of the two combined dopants with the abilities of tactics 1 and 2, such as in an Ag alloy including palladium and copper (APC), and including neodymium and gold (ANA) is expected to be very high. The aggregation resistance of an Ag alloy including two dopants is evaluated by a salt water immersion test. The APC and ANA demonstrated a very high resistance to Cl, because of the combination of the dopants working with tactic 1 (Pd, Au) and tactic 2 (Cu, Nd).
The multilayer sputter coating with an ANA layer demonstrated a very interesting profile where the light transmittance and the electrical sheet resistance are almost the same as the multilayer sputter coating with a pure Ag. The multilayer sputter coating with AIS also demonstrates a very interesting profile, where the light transmittance is higher than the multilayer sputter coating with a pure Ag. |
| doi_str_mv | 10.1016/j.corsci.2009.06.044 |
| format | Article |
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n
Cl and stack, triggered by Cl from the outside according to the mechanism described. This would lead to an aggregate with a high Ag density. It is suggested that this would be the generating mechanism of the silver-gray aggregate consisting mostly of Ag, which is generated by exposing it to Cl.
Two tactics in order to prevent restrain aggregation induced by Cl according to the mechanism are proposed. Tactic 1 is a restraining of structure change to a plane in the process of Ag
6Cl
+
Ag
→
Ag
7Cl. Tactic 2 is the trapping of Cl before it generates a bond to Ag.
The ability of the two combined dopants with the abilities of tactics 1 and 2, such as in an Ag alloy including palladium and copper (APC), and including neodymium and gold (ANA) is expected to be very high. The aggregation resistance of an Ag alloy including two dopants is evaluated by a salt water immersion test. The APC and ANA demonstrated a very high resistance to Cl, because of the combination of the dopants working with tactic 1 (Pd, Au) and tactic 2 (Cu, Nd).
The multilayer sputter coating with an ANA layer demonstrated a very interesting profile where the light transmittance and the electrical sheet resistance are almost the same as the multilayer sputter coating with a pure Ag. The multilayer sputter coating with AIS also demonstrates a very interesting profile, where the light transmittance is higher than the multilayer sputter coating with a pure Ag.</description><identifier>ISSN: 0010-938X</identifier><identifier>EISSN: 1879-0496</identifier><identifier>DOI: 10.1016/j.corsci.2009.06.044</identifier><identifier>CODEN: CRRSAA</identifier><language>eng</language><publisher>Kidlington: Elsevier Ltd</publisher><subject>A. Silver ; Applied sciences ; B. Modelling studies ; C. Chlorination ; Corrosion ; Corrosion environments ; Cross-disciplinary physics: materials science; rheology ; Exact sciences and technology ; Materials science ; Metals. Metallurgy ; Methods of deposition of films and coatings; film growth and epitaxy ; Physics</subject><ispartof>Corrosion science, 2009-11, Vol.51 (11), p.2557-2564</ispartof><rights>2009 Elsevier Ltd</rights><rights>2015 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c367t-200173df2387bad8d225e8fc899cf7ce70353881b33f92a35ace7ec201eb42d33</citedby><cites>FETCH-LOGICAL-c367t-200173df2387bad8d225e8fc899cf7ce70353881b33f92a35ace7ec201eb42d33</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/j.corsci.2009.06.044$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,780,784,3550,27924,27925,45995</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=22059228$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Koike, Katsuhiko</creatorcontrib><creatorcontrib>Shimada, Koichi</creatorcontrib><creatorcontrib>Fukuda, Shin</creatorcontrib><title>Aggregation in thin-film silver: Induced by chlorine and inhibited by alloying with two dopants</title><title>Corrosion science</title><description>The Ag aggregation mechanism triggered by chlorine (Cl) is discussed. The frontier orbital theory by K. Fukui is applied in order to determine the growing point in the silver (Ag) cluster. Ag in the thin-film silver would grow to Ag
n
Cl and stack, triggered by Cl from the outside according to the mechanism described. This would lead to an aggregate with a high Ag density. It is suggested that this would be the generating mechanism of the silver-gray aggregate consisting mostly of Ag, which is generated by exposing it to Cl.
Two tactics in order to prevent restrain aggregation induced by Cl according to the mechanism are proposed. Tactic 1 is a restraining of structure change to a plane in the process of Ag
6Cl
+
Ag
→
Ag
7Cl. Tactic 2 is the trapping of Cl before it generates a bond to Ag.
The ability of the two combined dopants with the abilities of tactics 1 and 2, such as in an Ag alloy including palladium and copper (APC), and including neodymium and gold (ANA) is expected to be very high. The aggregation resistance of an Ag alloy including two dopants is evaluated by a salt water immersion test. The APC and ANA demonstrated a very high resistance to Cl, because of the combination of the dopants working with tactic 1 (Pd, Au) and tactic 2 (Cu, Nd).
The multilayer sputter coating with an ANA layer demonstrated a very interesting profile where the light transmittance and the electrical sheet resistance are almost the same as the multilayer sputter coating with a pure Ag. The multilayer sputter coating with AIS also demonstrates a very interesting profile, where the light transmittance is higher than the multilayer sputter coating with a pure Ag.</description><subject>A. Silver</subject><subject>Applied sciences</subject><subject>B. Modelling studies</subject><subject>C. Chlorination</subject><subject>Corrosion</subject><subject>Corrosion environments</subject><subject>Cross-disciplinary physics: materials science; rheology</subject><subject>Exact sciences and technology</subject><subject>Materials science</subject><subject>Metals. Metallurgy</subject><subject>Methods of deposition of films and coatings; film growth and epitaxy</subject><subject>Physics</subject><issn>0010-938X</issn><issn>1879-0496</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2009</creationdate><recordtype>article</recordtype><recordid>eNp9kMFq3DAQhkVpodu0b9CDLs3Nzljy2lIOgRDSJhDIpYXehCzJu7NopY2kTdi3r4JDjzkJRt_8M_MR8r2DtoNuuNi1JqZssGUAsoWhhb7_QFadGGUDvRw-khVAB43k4u9n8iXnHQCwWlkRdb3ZJLfRBWOgGGjZYmhm9Hua0T-7dEnvgz0aZ-l0ombrY8LgqA62wlucsCw_2vt4wrChL1i2tLxEauNBh5K_kk-z9tl9e3vPyJ-ft79v7pqHx1_3N9cPjeHDWJq6eDdyOzMuxklbYRlbOzEbIaWZR-NG4GsuRDdxPkum-VrXmjP1Bjf1zHJ-Rs6X3EOKT0eXi9pjNs57HVw8ZsX7KmMEWcF-AU2KOSc3q0PCvU4n1YF6tal2arGpXm0qGFS1Wdt-vOXrbLSfkw4G8_9exmAtGROVu1o4V499RpdUTXKhCsTkTFE24vuD_gFjJ42f</recordid><startdate>20091101</startdate><enddate>20091101</enddate><creator>Koike, Katsuhiko</creator><creator>Shimada, Koichi</creator><creator>Fukuda, Shin</creator><general>Elsevier Ltd</general><general>Elsevier</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SE</scope><scope>8BQ</scope><scope>8FD</scope><scope>F28</scope><scope>FR3</scope><scope>JG9</scope></search><sort><creationdate>20091101</creationdate><title>Aggregation in thin-film silver: Induced by chlorine and inhibited by alloying with two dopants</title><author>Koike, Katsuhiko ; Shimada, Koichi ; Fukuda, Shin</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c367t-200173df2387bad8d225e8fc899cf7ce70353881b33f92a35ace7ec201eb42d33</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2009</creationdate><topic>A. Silver</topic><topic>Applied sciences</topic><topic>B. Modelling studies</topic><topic>C. Chlorination</topic><topic>Corrosion</topic><topic>Corrosion environments</topic><topic>Cross-disciplinary physics: materials science; rheology</topic><topic>Exact sciences and technology</topic><topic>Materials science</topic><topic>Metals. Metallurgy</topic><topic>Methods of deposition of films and coatings; film growth and epitaxy</topic><topic>Physics</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Koike, Katsuhiko</creatorcontrib><creatorcontrib>Shimada, Koichi</creatorcontrib><creatorcontrib>Fukuda, Shin</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Corrosion Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><collection>Materials Research Database</collection><jtitle>Corrosion science</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Koike, Katsuhiko</au><au>Shimada, Koichi</au><au>Fukuda, Shin</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Aggregation in thin-film silver: Induced by chlorine and inhibited by alloying with two dopants</atitle><jtitle>Corrosion science</jtitle><date>2009-11-01</date><risdate>2009</risdate><volume>51</volume><issue>11</issue><spage>2557</spage><epage>2564</epage><pages>2557-2564</pages><issn>0010-938X</issn><eissn>1879-0496</eissn><coden>CRRSAA</coden><abstract>The Ag aggregation mechanism triggered by chlorine (Cl) is discussed. The frontier orbital theory by K. Fukui is applied in order to determine the growing point in the silver (Ag) cluster. Ag in the thin-film silver would grow to Ag
n
Cl and stack, triggered by Cl from the outside according to the mechanism described. This would lead to an aggregate with a high Ag density. It is suggested that this would be the generating mechanism of the silver-gray aggregate consisting mostly of Ag, which is generated by exposing it to Cl.
Two tactics in order to prevent restrain aggregation induced by Cl according to the mechanism are proposed. Tactic 1 is a restraining of structure change to a plane in the process of Ag
6Cl
+
Ag
→
Ag
7Cl. Tactic 2 is the trapping of Cl before it generates a bond to Ag.
The ability of the two combined dopants with the abilities of tactics 1 and 2, such as in an Ag alloy including palladium and copper (APC), and including neodymium and gold (ANA) is expected to be very high. The aggregation resistance of an Ag alloy including two dopants is evaluated by a salt water immersion test. The APC and ANA demonstrated a very high resistance to Cl, because of the combination of the dopants working with tactic 1 (Pd, Au) and tactic 2 (Cu, Nd).
The multilayer sputter coating with an ANA layer demonstrated a very interesting profile where the light transmittance and the electrical sheet resistance are almost the same as the multilayer sputter coating with a pure Ag. The multilayer sputter coating with AIS also demonstrates a very interesting profile, where the light transmittance is higher than the multilayer sputter coating with a pure Ag.</abstract><cop>Kidlington</cop><pub>Elsevier Ltd</pub><doi>10.1016/j.corsci.2009.06.044</doi><tpages>8</tpages></addata></record> |
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| subjects | A. Silver Applied sciences B. Modelling studies C. Chlorination Corrosion Corrosion environments Cross-disciplinary physics: materials science rheology Exact sciences and technology Materials science Metals. Metallurgy Methods of deposition of films and coatings film growth and epitaxy Physics |
| title | Aggregation in thin-film silver: Induced by chlorine and inhibited by alloying with two dopants |
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