A fully stress-parametrized model for the dielectric function of silicon-on-insulator layers

Variable angle spectroscopic ellipsometry was used to measure the dielectric function of a silicon-on-insulator sample that was bent to induce defined stress incrementally up to about 200 MPa, as determined from the sample curvature and verified by Raman spectroscopy. The dielectric function at 1.2-...

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Veröffentlicht in:Semiconductor science and technology 2009-04, Vol.24 (4), p.045013-045013 (4)
Hauptverfasser: Chong, Zhijiat, Weisheit, Martin, Hecker, Michael, Zschech, Ehrenfried
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creator Chong, Zhijiat
Weisheit, Martin
Hecker, Michael
Zschech, Ehrenfried
description Variable angle spectroscopic ellipsometry was used to measure the dielectric function of a silicon-on-insulator sample that was bent to induce defined stress incrementally up to about 200 MPa, as determined from the sample curvature and verified by Raman spectroscopy. The dielectric function at 1.2-6.4 eV of each stress state was modeled by four Tauc-Lorentz oscillators. By parametrizing all Tauc-Lorentz peak parameters with the induced stress, a Si dielectric function model was derived that depends solely on the stress in the layer, enabling accurate and fast stress determination by ellipsometry.
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subjects Condensed matter: electronic structure, electrical, magnetic, and optical properties
Exact sciences and technology
Optical properties and condensed-matter spectroscopy and other interactions of matter with particles and radiation
Optical properties of specific thin films
Physics
title A fully stress-parametrized model for the dielectric function of silicon-on-insulator layers
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