Effect of boron content in electroless Ni–B layer on plating layer properties and soldering characteristics with Sn–Ag solder

The surface morphology, electrical property, solderability and interfacial reaction with Sn–3.5 wt.%Ag solder of two electroless nickel–boron (EN–B) deposits (Ni–1 wt.%B and Ni–3 wt.%B) were investigated. The B content of the EN–B layer decreased with increasing pH value. The crystallinity and solde...

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Veröffentlicht in:	Journal of alloys and compounds 2008-10, Vol.466 (1), p.73-79
Hauptverfasser:	Yoon, Jeong-Won, Koo, Ja-Myeong, Kim, Jong-Woong, Ha, Sang-Su, Noh, Bo-In, Lee, Chang-Yong, Park, Jong-Hyun, Shur, Chang-Chae, Jung, Seung-Boo
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Brazing. Soldering Diffusion Exact sciences and technology Joining, thermal cutting: metallurgical aspects Kinetics Metallography Metals. Metallurgy Solid state reactions Surfaces and interfaces
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