Influence of Field Plate on the Transient Operation of the AlGaN/GaN HEMT

In this letter, a link between the AlGaN/GaN high-electron-mobility-transistor (HEMT) field plate (FP) and the rate of reoccupation of surface traps is presented. Surface traps are considered to be among the primary factors behind HEMT performance deterioration at high frequencies. Results from simu...

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Veröffentlicht in:IEEE electron device letters 2009-05, Vol.30 (5), p.436-438
Hauptverfasser: Brannick, A., Zakhleniuk, N.A., Ridley, B.K., Shealy, J.R., Schaff, W.J., Eastman, L.F.
Format: Artikel
Sprache:eng
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Zusammenfassung:In this letter, a link between the AlGaN/GaN high-electron-mobility-transistor (HEMT) field plate (FP) and the rate of reoccupation of surface traps is presented. Surface traps are considered to be among the primary factors behind HEMT performance deterioration at high frequencies. Results from simulations using the commercial software package DESSIS are presented, in which the FP is found to reduce trap reoccupation by limiting the tunneling injection of electrons into surface traps in the gate-drain region and thus considerably improve the transient operation of the device.
ISSN:0741-3106
1558-0563
DOI:10.1109/LED.2009.2016680