Electromigration Resistant Power Delivery Systems

It is well known that electromigration (EM) time-to-failure for ac is several orders of magnitude larger than for dc. We propose a novel technique that reverses current direction in the power delivery system of a microprocessor every time it is rebooted. This improves EM time-to-failure of solder bu...

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Veröffentlicht in:	IEEE electron device letters 2007-08, Vol.28 (8), p.767-769
Hauptverfasser:	Sekar, D.C., Dang, B., Davis, J.A., Meindl, J.D.
Format:	Artikel
Sprache:	eng
Schlagworte:	Alternating current Applied sciences Current density Delivery systems Design. Technologies. Operation analysis. Testing Devices Direct current Electromigration electromigration (EM) Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Exact sciences and technology flip-chip devices Frequency Integrated circuit interconnections Integrated circuits Integrated circuits by function (including memories and processors) Mean time to failure Microprocessors Packaging Power system interconnection Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Sleep Solders Temperature Wiring
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Beschreibung
Zusammenfassung:	It is well known that electromigration (EM) time-to-failure for ac is several orders of magnitude larger than for dc. We propose a novel technique that reverses current direction in the power delivery system of a microprocessor every time it is rebooted. This improves EM time-to-failure of solder bumps and on-chip global interconnects and vias in the power delivery system.
ISSN:	0741-3106 1558-0563
DOI:	10.1109/LED.2007.902165