Development of warpage and residual stresses in film insert molded parts
Residual stresses, bending moments, and warpage of film insert molded (FIM) parts were investigated by experimental and numerical analyses. Thermally induced residual stresses in FIM parts were predicted by numerical simulations with both commercial and house codes. Bending moments and warpage of FI...
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| Veröffentlicht in: | Polymer engineering and science 2009-07, Vol.49 (7), p.1389-1399 |
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| creator | Oh, Hwa Jin Song, Young Seok Lee, Seung Hwan Youn, Jae Ryoun |
| description | Residual stresses, bending moments, and warpage of film insert molded (FIM) parts were investigated by experimental and numerical analyses. Thermally induced residual stresses in FIM parts were predicted by numerical simulations with both commercial and house codes. Bending moments and warpage of FIM tensile specimens were calculated numerically and compared with experimental results. Thermally induced residual stresses were predicted by utilizing a one‐dimensional thermoelastic model where constant material properties are assumed. The residual stress distribution depended remarkably on the Biot number and the heat was removed rapidly through the surface resulting in high residual stresses. Asymmetric residual stresses generated by nonuniform cooling of the part provoked nonuniform shrinkage and warpage of the molded tensile specimen. It was found that the numerically calculated bending moment is in good agreement with the experimental results. POLYM. ENG. SCI., 2009. © 2009 Society of Plastics Engineers |
| doi_str_mv | 10.1002/pen.21354 |
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Thermally induced residual stresses in FIM parts were predicted by numerical simulations with both commercial and house codes. Bending moments and warpage of FIM tensile specimens were calculated numerically and compared with experimental results. Thermally induced residual stresses were predicted by utilizing a one‐dimensional thermoelastic model where constant material properties are assumed. The residual stress distribution depended remarkably on the Biot number and the heat was removed rapidly through the surface resulting in high residual stresses. Asymmetric residual stresses generated by nonuniform cooling of the part provoked nonuniform shrinkage and warpage of the molded tensile specimen. It was found that the numerically calculated bending moment is in good agreement with the experimental results. POLYM. ENG. SCI., 2009. © 2009 Society of Plastics Engineers</description><identifier>ISSN: 0032-3888</identifier><identifier>EISSN: 1548-2634</identifier><identifier>DOI: 10.1002/pen.21354</identifier><identifier>CODEN: PYESAZ</identifier><language>eng</language><publisher>Hoboken: Wiley Subscription Services, Inc., A Wiley Company</publisher><subject>Applied sciences ; Dielectric films ; Evaluation ; Exact sciences and technology ; Injection moulding ; Machinery and processing ; Measurement ; Mechanical properties ; Molds & molding ; Moulding ; Plastics ; Polymer films ; Polymer industry, paints, wood ; Polymer processing ; Production processes ; Residual stress ; Residual stresses ; Technology of polymers ; Tensile strength ; Thin films</subject><ispartof>Polymer engineering and science, 2009-07, Vol.49 (7), p.1389-1399</ispartof><rights>Copyright © 2009 Society of Plastics Engineers</rights><rights>2015 INIST-CNRS</rights><rights>COPYRIGHT 2009 Society of Plastics Engineers, Inc.</rights><rights>Copyright Society of Plastics Engineers Jul 2009</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c6094-292fa79d260945478090b4e4f7afa70494f8a16765bc4703d81532e98d7f61833</citedby><cites>FETCH-LOGICAL-c6094-292fa79d260945478090b4e4f7afa70494f8a16765bc4703d81532e98d7f61833</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://onlinelibrary.wiley.com/doi/pdf/10.1002%2Fpen.21354$$EPDF$$P50$$Gwiley$$H</linktopdf><linktohtml>$$Uhttps://onlinelibrary.wiley.com/doi/full/10.1002%2Fpen.21354$$EHTML$$P50$$Gwiley$$H</linktohtml><link.rule.ids>314,780,784,1416,27922,27923,45572,45573</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=21684601$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Oh, Hwa Jin</creatorcontrib><creatorcontrib>Song, Young Seok</creatorcontrib><creatorcontrib>Lee, Seung Hwan</creatorcontrib><creatorcontrib>Youn, Jae Ryoun</creatorcontrib><title>Development of warpage and residual stresses in film insert molded parts</title><title>Polymer engineering and science</title><addtitle>Polym Eng Sci</addtitle><description>Residual stresses, bending moments, and warpage of film insert molded (FIM) parts were investigated by experimental and numerical analyses. Thermally induced residual stresses in FIM parts were predicted by numerical simulations with both commercial and house codes. Bending moments and warpage of FIM tensile specimens were calculated numerically and compared with experimental results. Thermally induced residual stresses were predicted by utilizing a one‐dimensional thermoelastic model where constant material properties are assumed. The residual stress distribution depended remarkably on the Biot number and the heat was removed rapidly through the surface resulting in high residual stresses. Asymmetric residual stresses generated by nonuniform cooling of the part provoked nonuniform shrinkage and warpage of the molded tensile specimen. It was found that the numerically calculated bending moment is in good agreement with the experimental results. POLYM. ENG. SCI., 2009. © 2009 Society of Plastics Engineers</description><subject>Applied sciences</subject><subject>Dielectric films</subject><subject>Evaluation</subject><subject>Exact sciences and technology</subject><subject>Injection moulding</subject><subject>Machinery and processing</subject><subject>Measurement</subject><subject>Mechanical properties</subject><subject>Molds & molding</subject><subject>Moulding</subject><subject>Plastics</subject><subject>Polymer films</subject><subject>Polymer industry, paints, wood</subject><subject>Polymer processing</subject><subject>Production processes</subject><subject>Residual stress</subject><subject>Residual stresses</subject><subject>Technology of polymers</subject><subject>Tensile strength</subject><subject>Thin films</subject><issn>0032-3888</issn><issn>1548-2634</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2009</creationdate><recordtype>article</recordtype><sourceid>N95</sourceid><sourceid>8G5</sourceid><sourceid>ABUWG</sourceid><sourceid>AFKRA</sourceid><sourceid>AZQEC</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><sourceid>GNUQQ</sourceid><sourceid>GUQSH</sourceid><sourceid>M2O</sourceid><recordid>eNp1kt1u1DAQhSMEEkvhgjeIkEBCIlv_xbEvq1LaotWCKJRLy5tMFhfHST0JpW-Pl10qihb5YmzrO0czR5NlzymZU0LY4QBhzigvxYNsRkuhCia5eJjNCOGs4Eqpx9kTxCuSWF7qWXb2Fn6A74cOwpj3bX5j42DXkNvQ5BHQNZP1OY7pioC5C3nrfJcqQhzzrvcNNPlg44hPs0et9QjPdvUg-_Lu5PPxWbH4cHp-fLQoakm0KJhmra10wzavUlSKaLISINrKpn8itGiVpbKS5aoWFeGNoiVnoFVTtZIqzg-yV1vfIfbXE-BoOoc1eG8D9BMaLoQmXNMEvvgHvOqnGFJvhlElOSGyTFCxhdbWg3Gh7cdo6zUEiNb3AdK0YI4Y4ZWUXJHEz_fw6TTQuXqv4PU9QWJG-Dmu7YRozi8-3Wff_MWuJnQhxZ6ydutvI24l-6zr2CNGaM0QXWfjraHEbJbBpGUwv5chsS93YVisrW-jDbXDOwGjUglJNqEdbrmbNMft_w3Nx5PlH-ddgg7TYHcKG78bWfGqNF-Xp-Y955eXi-WF0fwXp4HNrQ</recordid><startdate>200907</startdate><enddate>200907</enddate><creator>Oh, Hwa Jin</creator><creator>Song, Young Seok</creator><creator>Lee, Seung Hwan</creator><creator>Youn, Jae Ryoun</creator><general>Wiley Subscription Services, Inc., A Wiley Company</general><general>Wiley</general><general>Society of Plastics Engineers, Inc</general><general>Blackwell Publishing Ltd</general><scope>BSCLL</scope><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>N95</scope><scope>XI7</scope><scope>ISR</scope><scope>3V.</scope><scope>7SR</scope><scope>7XB</scope><scope>88I</scope><scope>8AF</scope><scope>8FD</scope><scope>8FE</scope><scope>8FG</scope><scope>8FK</scope><scope>8G5</scope><scope>ABJCF</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>ARAPS</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>GNUQQ</scope><scope>GUQSH</scope><scope>HCIFZ</scope><scope>JG9</scope><scope>KB.</scope><scope>L6V</scope><scope>M2O</scope><scope>M2P</scope><scope>M7S</scope><scope>MBDVC</scope><scope>P5Z</scope><scope>P62</scope><scope>PDBOC</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>PTHSS</scope><scope>Q9U</scope><scope>S0X</scope></search><sort><creationdate>200907</creationdate><title>Development of warpage and residual stresses in film insert molded parts</title><author>Oh, Hwa Jin ; 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Thermally induced residual stresses in FIM parts were predicted by numerical simulations with both commercial and house codes. Bending moments and warpage of FIM tensile specimens were calculated numerically and compared with experimental results. Thermally induced residual stresses were predicted by utilizing a one‐dimensional thermoelastic model where constant material properties are assumed. The residual stress distribution depended remarkably on the Biot number and the heat was removed rapidly through the surface resulting in high residual stresses. Asymmetric residual stresses generated by nonuniform cooling of the part provoked nonuniform shrinkage and warpage of the molded tensile specimen. It was found that the numerically calculated bending moment is in good agreement with the experimental results. POLYM. ENG. SCI., 2009. © 2009 Society of Plastics Engineers</abstract><cop>Hoboken</cop><pub>Wiley Subscription Services, Inc., A Wiley Company</pub><doi>10.1002/pen.21354</doi><tpages>11</tpages></addata></record> |
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| subjects | Applied sciences Dielectric films Evaluation Exact sciences and technology Injection moulding Machinery and processing Measurement Mechanical properties Molds & molding Moulding Plastics Polymer films Polymer industry, paints, wood Polymer processing Production processes Residual stress Residual stresses Technology of polymers Tensile strength Thin films |
| title | Development of warpage and residual stresses in film insert molded parts |
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