High-Reliability Connection Products for Packaging Technology in Microelectronics

The current reliability problems related to bonding wires and solder paste are shown, and possible solutions are discussed. Five morphological categories of failure modes are identified. We set out the basic principles for specifying solder pastes, especially with regard to the powder used. The cont...

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Veröffentlicht in:	Advanced engineering materials 2009-04, Vol.11 (4), p.302-308
Hauptverfasser:	Trodler, Joerg, Mueller, Tobias
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Chips Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology Integrated circuits Reliability Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Solder paste Substrates Wafer bumping Wire bonds
Online-Zugang:	Volltext
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