Pressure-dependent real-time investigations on the rapid thermal sulfurization of Cu–In thin films

Rapid thermal processing (RTP) under high sulfur partial pressure of copper rich Cu–In alloy thin films is investigated using in situ energy dispersive X-ray diffraction (EDXRD). Cu–In precursors are sulfurized at S vapor pressures in the 1 mbar range. Diffraction of white synchrotron light and reco...

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Veröffentlicht in:Journal of crystal growth 2008-07, Vol.310 (15), p.3638-3644
Hauptverfasser: Rodriguez-Alvarez, H., Kötschau, I.M., Schock, H.W.
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container_end_page 3644
container_issue 15
container_start_page 3638
container_title Journal of crystal growth
container_volume 310
creator Rodriguez-Alvarez, H.
Kötschau, I.M.
Schock, H.W.
description Rapid thermal processing (RTP) under high sulfur partial pressure of copper rich Cu–In alloy thin films is investigated using in situ energy dispersive X-ray diffraction (EDXRD). Cu–In precursors are sulfurized at S vapor pressures in the 1 mbar range. Diffraction of white synchrotron light and recording of EDXRD spectra every 10 s at the EDDI beamline of the BESSY facility is used to monitor in situ the solid phases during the sulfurization and the subsequent cool-down. Ternary CuInS 2 forms via the binary InS and CuS and the ternary CuIn 5S 8 phases. The concentration of copper in the secondary Cu 2− x S phase, which segregates on the surface of the CuInS 2, shows a strong dependence on the maximum sulfur pressure during the RTP-like process.
doi_str_mv 10.1016/j.jcrysgro.2008.05.005
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subjects A1. Growth monitoring
A1. Phase transitions
A3. Thin film
B1. Chalcopyrite
B3. Solar cell
Condensed matter: structure, mechanical and thermal properties
Exact sciences and technology
Other nonelectronic physical properties
Physical properties of thin films, nonelectronic
Physics
Structure and morphology
thickness
Surfaces and interfaces
thin films and whiskers (structure and nonelectronic properties)
Thin film structure and morphology
title Pressure-dependent real-time investigations on the rapid thermal sulfurization of Cu–In thin films
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