Study on the properties of Sn–9Zn– xCr lead-free solder

The influences of different Cr content to lead (Sn)–Zn solder were investigated. Sn–9Zn– xCr shows finer and more uniform microstructure than Sn–9Zn. Thermal gravimetric analysis (TGA) and Auger electron spectroscopy (AES) results show that adding Cr significantly improves the oxidation resistance o...

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Veröffentlicht in:	Journal of alloys and compounds 2008-07, Vol.460 (1), p.478-484
Hauptverfasser:	Chen, Xi, Hu, Anmin, Li, Ming, Mao, Dali
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Brazing. Soldering Exact sciences and technology Joining, thermal cutting: metallurgical aspects Mechanical properties Metals. Metallurgy Microstructure Oxidation
Online-Zugang:	Volltext
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