Self-Sealing of Nanoporous Low Dielectric Constant Patterns Fabricated by Nanoimprint Lithography

Self-Sealing of Nanoporous Low Dielectric Constant Patterns Fabricated by Nanoimprint Lithography

The cross‐sectional TEM image shows that line‐space patterns can be directly imprinted, with high fidelity, into highly porous spin‐on organosilicate materials. This publication quantifies how the porosity and distribution of pores within the patterns are affected by the nanoimprint lithography proc...

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Veröffentlicht in:Advanced materials (Weinheim) 2008-05, Vol.20 (10), p.1934-1939
Hauptverfasser: Ro, Hyun Wook, Peng, Huagen, Niihara, Ken-ichi, Lee, Hae-Jeong, Lin, Eric K., Karim, Alamgir, Gidley, David W., Jinnai, Hiroshi, Yoon, Do Y., Soles, Christopher L.
Format: Artikel
Sprache:eng
Schlagworte:
nanolithography
organosilicates
patterning
porous materials
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Zusammenfassung:The cross‐sectional TEM image shows that line‐space patterns can be directly imprinted, with high fidelity, into highly porous spin‐on organosilicate materials. This publication quantifies how the porosity and distribution of pores within the patterns are affected by the nanoimprint lithography processes, including evidence for a densified pattern surface.
ISSN:0935-9648
1521-4095
DOI:10.1002/adma.200701994