Novel hydrophobic/hydrophilic patterning process by photocatalytic Ag nucleation on TiO2 thin film and electroless Cu deposition
A hydrophobic/er-hydrophilic pattern was prepared on a TiO2 thin film by a new fabrication process. The process consists of five key steps: (1) photocatalytic reduction of Ag+ to Ag (nucleation), (2) electroless Cu deposition, (3) oxidation of Cu to CuO, (4) deposition of a self-assembled monolayer...
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| Veröffentlicht in: | Applied surface science 2008-07, Vol.254 (18), p.5891-5894 |
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| container_title | Applied surface science |
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| creator | NISHIMOTO, Shunsuke KUBO, Atsushi XINTONG ZHANG ZHAOYUE LIU TANEICHI, Noriaki OKUI, Toshiki MURAKAMI, Taketoshi KOMINE, Takashi FUJISHIMA, Akira |
| description | A hydrophobic/er-hydrophilic pattern was prepared on a TiO2 thin film by a new fabrication process. The process consists of five key steps: (1) photocatalytic reduction of Ag+ to Ag (nucleation), (2) electroless Cu deposition, (3) oxidation of Cu to CuO, (4) deposition of a self-assembled monolayer (SAM), and (5) photocatalytic decomposition of selected areas of the SAM. A hydrophobic/er-hydrophilic pattern with 500-mum2 hydrophilic areas was obtained in this process. It is particularly noteworthy that a UV irradiation time of only 1 s was sufficient for the nucleation step in the patterning process. |
| doi_str_mv | 10.1016/j.apsusc.2008.03.153 |
| format | Article |
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| source | Elsevier ScienceDirect Journals Complete |
| subjects | Catalytic methods Cross-disciplinary physics: materials science rheology Exact sciences and technology Materials science Methods of nanofabrication Physics Surface cleaning, etching, patterning Surface treatments |
| title | Novel hydrophobic/hydrophilic patterning process by photocatalytic Ag nucleation on TiO2 thin film and electroless Cu deposition |
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