Growth kinetics of intermetallic compounds and tensile properties of Sn–Ag–Cu/Ag single crystal joint
The growth kinetics and interfacial morphologies of intermetallic compounds (IMCs) and tensile properties of single crystal Ag/Sn–3.8Ag–0.7Cu (SAC) solder joint were investigated by solid-state aging at 170 °C and liquid-state aging at 250 °C. It is found that the growth kinetics of IMCs under both...
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| Veröffentlicht in: | Journal of alloys and compounds 2008-08, Vol.461 (1), p.410-417 |
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| container_end_page | 417 |
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| container_title | Journal of alloys and compounds |
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| creator | Zou, Hefei Zhu, Qingsheng Zhang, Zhefeng |
| description | The growth kinetics and interfacial morphologies of intermetallic compounds (IMCs) and tensile properties of single crystal Ag/Sn–3.8Ag–0.7Cu (SAC) solder joint were investigated by solid-state aging at 170
°C and liquid-state aging at 250
°C. It is found that the growth kinetics of IMCs under both solid- and liquid-state aging conditions follow parabola relationship. Accordingly, the diffusion coefficients under the two conditions were calculated to be about 2.50
×
10
−17
m
2
s
−1 and 1.60
×
10
−14
m
2
s
−1, respectively. With increasing aging time, the scallop-like morphology of the IMC gradually evolved into planar type after solid-state aging; but it became rougher after liquid-state aging. Meanwhile, the average grain size of IMC also increases with increasing aging time. The tensile strength of the Sn–Ag–Cu/Ag single crystal joints did not decrease seriously with increasing aging time and the corresponding tensile fracture mechanism was discussed. |
| doi_str_mv | 10.1016/j.jallcom.2007.07.001 |
| format | Article |
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°C and liquid-state aging at 250
°C. It is found that the growth kinetics of IMCs under both solid- and liquid-state aging conditions follow parabola relationship. Accordingly, the diffusion coefficients under the two conditions were calculated to be about 2.50
×
10
−17
m
2
s
−1 and 1.60
×
10
−14
m
2
s
−1, respectively. With increasing aging time, the scallop-like morphology of the IMC gradually evolved into planar type after solid-state aging; but it became rougher after liquid-state aging. Meanwhile, the average grain size of IMC also increases with increasing aging time. The tensile strength of the Sn–Ag–Cu/Ag single crystal joints did not decrease seriously with increasing aging time and the corresponding tensile fracture mechanism was discussed.</description><identifier>ISSN: 0925-8388</identifier><identifier>EISSN: 1873-4669</identifier><identifier>DOI: 10.1016/j.jallcom.2007.07.001</identifier><language>eng</language><publisher>Lausanne: Elsevier B.V</publisher><subject>Ag single crystal substrate ; Applied sciences ; Brazing. Soldering ; Elasticity. Plasticity ; Exact sciences and technology ; Fracture ; Growth kinetics ; Intermetallic compounds (IMCs) ; Joining, thermal cutting: metallurgical aspects ; Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology ; Metals. Metallurgy ; Sn–3.8Ag–0.7Cu solder ; Tensile strength</subject><ispartof>Journal of alloys and compounds, 2008-08, Vol.461 (1), p.410-417</ispartof><rights>2007 Elsevier B.V.</rights><rights>2008 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c370t-cfafea8ec7b37abc6a0a4b80d52ac7fd1648ab8d591d92467f71cfd33f522b033</citedby><cites>FETCH-LOGICAL-c370t-cfafea8ec7b37abc6a0a4b80d52ac7fd1648ab8d591d92467f71cfd33f522b033</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/j.jallcom.2007.07.001$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,780,784,3550,27924,27925,45995</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=20487150$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Zou, Hefei</creatorcontrib><creatorcontrib>Zhu, Qingsheng</creatorcontrib><creatorcontrib>Zhang, Zhefeng</creatorcontrib><title>Growth kinetics of intermetallic compounds and tensile properties of Sn–Ag–Cu/Ag single crystal joint</title><title>Journal of alloys and compounds</title><description>The growth kinetics and interfacial morphologies of intermetallic compounds (IMCs) and tensile properties of single crystal Ag/Sn–3.8Ag–0.7Cu (SAC) solder joint were investigated by solid-state aging at 170
°C and liquid-state aging at 250
°C. It is found that the growth kinetics of IMCs under both solid- and liquid-state aging conditions follow parabola relationship. Accordingly, the diffusion coefficients under the two conditions were calculated to be about 2.50
×
10
−17
m
2
s
−1 and 1.60
×
10
−14
m
2
s
−1, respectively. With increasing aging time, the scallop-like morphology of the IMC gradually evolved into planar type after solid-state aging; but it became rougher after liquid-state aging. Meanwhile, the average grain size of IMC also increases with increasing aging time. The tensile strength of the Sn–Ag–Cu/Ag single crystal joints did not decrease seriously with increasing aging time and the corresponding tensile fracture mechanism was discussed.</description><subject>Ag single crystal substrate</subject><subject>Applied sciences</subject><subject>Brazing. Soldering</subject><subject>Elasticity. Plasticity</subject><subject>Exact sciences and technology</subject><subject>Fracture</subject><subject>Growth kinetics</subject><subject>Intermetallic compounds (IMCs)</subject><subject>Joining, thermal cutting: metallurgical aspects</subject><subject>Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology</subject><subject>Metals. Metallurgy</subject><subject>Sn–3.8Ag–0.7Cu solder</subject><subject>Tensile strength</subject><issn>0925-8388</issn><issn>1873-4669</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2008</creationdate><recordtype>article</recordtype><recordid>eNqFkMGOFCEURYnRxHb0E0zY6K56oKgqqJXpdJxxkklcqGtCPR4tZTW0QDuZnf_gH_ol0nbHrckLbM49Dy4hrzlbc8aH63k9m2WBuF-3jMn1aRh_QlZcSdF0wzA-JSs2tn2jhFLPyYucZ1aJUfAV8bcpPpSv9JsPWDxkGh31oWDaY6lSD7R6D_EYbKYmWFowZL8gPaR4wFQ8_k18Cr9__trs6rE9Xm92NPuwqxCkx1wtdI5V-ZI8c2bJ-OpyX5EvN-8_bz809x9v77ab-waEZKUBZxwahSAnIc0Eg2GmmxSzfWtAOsuHTplJ2X7kdmy7QTrJwVkhXN-2ExPiirw9e-sTvx8xF733GXBZTMB4zFqIfhik6ivYn0FIMeeETh-S35v0qDnTp2L1rC_F6lOx-jSM19ybywKTwSwumQA-_wu3rFOS96xy784c1t_-8Jh0Bo8B0PqEULSN_j-b_gDsqJWq</recordid><startdate>20080811</startdate><enddate>20080811</enddate><creator>Zou, Hefei</creator><creator>Zhu, Qingsheng</creator><creator>Zhang, Zhefeng</creator><general>Elsevier B.V</general><general>Elsevier</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>20080811</creationdate><title>Growth kinetics of intermetallic compounds and tensile properties of Sn–Ag–Cu/Ag single crystal joint</title><author>Zou, Hefei ; Zhu, Qingsheng ; Zhang, Zhefeng</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c370t-cfafea8ec7b37abc6a0a4b80d52ac7fd1648ab8d591d92467f71cfd33f522b033</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2008</creationdate><topic>Ag single crystal substrate</topic><topic>Applied sciences</topic><topic>Brazing. Soldering</topic><topic>Elasticity. Plasticity</topic><topic>Exact sciences and technology</topic><topic>Fracture</topic><topic>Growth kinetics</topic><topic>Intermetallic compounds (IMCs)</topic><topic>Joining, thermal cutting: metallurgical aspects</topic><topic>Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology</topic><topic>Metals. Metallurgy</topic><topic>Sn–3.8Ag–0.7Cu solder</topic><topic>Tensile strength</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Zou, Hefei</creatorcontrib><creatorcontrib>Zhu, Qingsheng</creatorcontrib><creatorcontrib>Zhang, Zhefeng</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Journal of alloys and compounds</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Zou, Hefei</au><au>Zhu, Qingsheng</au><au>Zhang, Zhefeng</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Growth kinetics of intermetallic compounds and tensile properties of Sn–Ag–Cu/Ag single crystal joint</atitle><jtitle>Journal of alloys and compounds</jtitle><date>2008-08-11</date><risdate>2008</risdate><volume>461</volume><issue>1</issue><spage>410</spage><epage>417</epage><pages>410-417</pages><issn>0925-8388</issn><eissn>1873-4669</eissn><abstract>The growth kinetics and interfacial morphologies of intermetallic compounds (IMCs) and tensile properties of single crystal Ag/Sn–3.8Ag–0.7Cu (SAC) solder joint were investigated by solid-state aging at 170
°C and liquid-state aging at 250
°C. It is found that the growth kinetics of IMCs under both solid- and liquid-state aging conditions follow parabola relationship. Accordingly, the diffusion coefficients under the two conditions were calculated to be about 2.50
×
10
−17
m
2
s
−1 and 1.60
×
10
−14
m
2
s
−1, respectively. With increasing aging time, the scallop-like morphology of the IMC gradually evolved into planar type after solid-state aging; but it became rougher after liquid-state aging. Meanwhile, the average grain size of IMC also increases with increasing aging time. The tensile strength of the Sn–Ag–Cu/Ag single crystal joints did not decrease seriously with increasing aging time and the corresponding tensile fracture mechanism was discussed.</abstract><cop>Lausanne</cop><pub>Elsevier B.V</pub><doi>10.1016/j.jallcom.2007.07.001</doi><tpages>8</tpages></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 0925-8388 |
| ispartof | Journal of alloys and compounds, 2008-08, Vol.461 (1), p.410-417 |
| issn | 0925-8388 1873-4669 |
| language | eng |
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| source | Elsevier ScienceDirect Journals Complete |
| subjects | Ag single crystal substrate Applied sciences Brazing. Soldering Elasticity. Plasticity Exact sciences and technology Fracture Growth kinetics Intermetallic compounds (IMCs) Joining, thermal cutting: metallurgical aspects Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology Metals. Metallurgy Sn–3.8Ag–0.7Cu solder Tensile strength |
| title | Growth kinetics of intermetallic compounds and tensile properties of Sn–Ag–Cu/Ag single crystal joint |
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