The effect of porogen loading on the stiffness and fracture energy of brittle organosilicates

Integrating porous low-permittivity dielectrics into Cu metallization is one of the strategies to reduce power consumption, signal propagation delays, and crosstalk between interconnects for the next generation of integrated circuits. The porosity and pore structure of these low-k dielectric materia...

Ausführliche Beschreibung

Bibliographische Detailangaben

Veröffentlicht in:	Journal of materials research 2009-01, Vol.24 (1), p.107-116
Hauptverfasser:	Li, Han, Lin, Youbo, Tsui, Ting Y., Vlassak, Joost J.
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied and Technical Physics Biomaterials Elastic properties Fracture Inorganic Chemistry Materials Engineering Materials Science Nanotechnology Porosity
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!