Wear-induced microstructure in Ni/Cu nano-multilayers

Sliding wear tests were carried out in order to investigate wear resistance and resultant microstructure of Ni/Cu multilayers. The Ni/Cu multilayers having the component layer thickness h ranging from 5 to 100 nm were fabricated on copper substrates using the elecrodeposition technique. It was found...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	Journal of materials science 2008-06, Vol.43 (11), p.3923-3930
Hauptverfasser:	Hattori, Tomoya, Kaneko, Yoshihisa, Hashimoto, Satoshi
Format:	Artikel
Sprache:	eng
Schlagworte:	Characterization and Evaluation of Materials Classical Mechanics Copper Crystallography and Scattering Methods Deformation wear Dynamic recrystallization Frictional wear Grains Intergranular and Interphase Boundaries in Materials Load resistance Materials Science Microstructure Multilayers Nickel coatings Polymer Sciences Protective coatings Rapid prototyping Sliding friction Solid Mechanics Substrates Surface cracks Thickness Wear resistance
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!