Interface thermal characteristics of flip chip packages – A numerical study

Flip chip ball grid array (FC-BGA) packages are commonly used for high inputs/outputs (I/O) ICs; they have been proven to provide good solutions for a variety of applications to maximize thermal and electrical performance. A fundamental limitation to such devices is the thermal resistance at the top...

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Veröffentlicht in:	Applied thermal engineering 2009-04, Vol.29 (5), p.822-829
Hauptverfasser:	Kandasamy, Ravi, Mujumdar, A.S.
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Effect of voids Energy Energy. Thermal use of fuels Exact sciences and technology Flip chip BGA Heat transfer Interface thermal resistance Numerical simulation Theoretical studies. Data and constants. Metering Thermal interface Materials
Online-Zugang:	Volltext
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