Intrinsically conductive polymer for PWB direct metallization: process reliability by process management

Purpose - The purpose of this paper is to describe in detail the direct metallization of printed wiring boards using ENVISION® HDI for the selective formation of intrinsic conductive polymer.Design methodology approach - The process technology offers several advantages over the most commonly used electroless copper process: including higher through-put; no deposition on metallic surfaces eliminating needs for post-treatment in a micro-etch, few process steps; significant reductions in water consumption and waste water, which does not contain hazardeous components such as metal, chelators and formaldehyde.Findings - ENVISION HDI consists of only three process modules (conditioner, initiator and catalyst), each controlled by standard analytical technologies. In addition the quality out-put of each module is monitored using a second set of standardized procedures, ensuring total process management, hence documenting complete process reliability.Originality value - This paper describes in detail quality control approaches for each process segment to provide a high level of performance and quality assurance for the process as a whole.