Effects of Trace Amounts of Rare Earth Additions on Microstructure and Properties of Sn-Bi-Based Solder Alloy

The effect of trace amounts of rare earth additions on the microstructure and properties were studied for the Sn-58Bi and Sn-58Bi-Ag solder alloys. At the same time, the intermetallic compounds (IMCs) in the solder alloys and intermetallic layer (IML) thickness at the solder/Cu substrate interface w...

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Veröffentlicht in:	Journal of electronic materials 2008-07, Vol.37 (7), p.982-991
Hauptverfasser:	Dong, Wenxing, Shi, Yaowu, Xia, Zhidong, Lei, Yongping, Guo, Fu
Format:	Artikel
Sprache:	eng
Schlagworte:	Alloys Applied sciences Brazing. Soldering Characterization and Evaluation of Materials Chemistry and Materials Science Electronics Electronics and Microelectronics Exact sciences and technology Instrumentation Joining, thermal cutting: metallurgical aspects Lead free solders Materials Materials Science Mechanical properties Metals. Metallurgy Microstructure Optical and Electronic Materials Silver Solid State Physics
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