Temperature-dependent texture, stress and resistivity in melt spun Cu0.95Co0.05 ribbon

Ribbon samples of Cu0.95Co0.05 were prepared by melt spinning method to perform systematic investigations on structure and transport properties as a function of annealing temperature. X-ray diffraction study shows that the ribbon is polycrystalline with a strong < 2 0 0 > texture along the sur...

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Veröffentlicht in:Physica. B, Condensed matter Condensed matter, 2008-06, Vol.403 (12), p.2059-2064
Hauptverfasser: MAJUMDAR, S, SINGHA, R. K, DAS, K, CHAKRABORTY, M, DAS, A. K, RAY, S. K
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container_end_page 2064
container_issue 12
container_start_page 2059
container_title Physica. B, Condensed matter
container_volume 403
creator MAJUMDAR, S
SINGHA, R. K
DAS, K
CHAKRABORTY, M
DAS, A. K
RAY, S. K
description Ribbon samples of Cu0.95Co0.05 were prepared by melt spinning method to perform systematic investigations on structure and transport properties as a function of annealing temperature. X-ray diffraction study shows that the ribbon is polycrystalline with a strong < 2 0 0 > texture along the surface normal of the as-quenched Cu0.95Co0.05 ribbon and the degree of texture is enhanced upon annealing. The compressive stress, which relaxes upon annealing, is observed in as-quenched ribbon. The resistivity, which is higher in as-quenched ribbon, decreases toward the bulk value of Cu upon annealing. The compressive stress and higher resistivity in as-quenched ribbon are attributed to the incorporation of Co atoms/particles in Cu matrix. The decrement of the stress and resistivity upon annealing is due to the precipitation of Co atoms from the Cu matrix, segregating as Co or Co-rich Cu grains as observed from the transmission electron microscopy measurements.
doi_str_mv 10.1016/j.physb.2007.11.030
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fullrecord <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_33190442</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>33190442</sourcerecordid><originalsourceid>FETCH-LOGICAL-c310t-39b9a1f0aa04683a39c4eff689ae922a5146e5716ca89630a2d9b67539bd14073</originalsourceid><addsrcrecordid>eNo9kMtOwzAQRS0EEqXwBWy8gRUJM3acxEtU8ZIqsSlsLSeZiFR5YTuI_j0prZjNjEbn3sVh7BohRsD0fhuPnztfxAIgixFjkHDCFphnMhIo1SlbgBYYJUqk5-zC-y3Mgxku2MeGupGcDZOjqKKR-or6wAP97D933AdH3nPbV3w-Gh-a7ybseNPzjtrA_Tj1fDVBrNVqgBgUd01RDP0lO6tt6-nquJfs_elxs3qJ1m_Pr6uHdVRKhBBJXWiLNVgLSZpLK3WZUF2nubakhbAKk5RUhmlpc51KsKLSRZqpOVdhAplcsttD7-iGr4l8MF3jS2pb29MweSMlakgSMYPyAJZu8N5RbUbXdNbtDILZOzRb8-fQ7B0aRDM7nFM3x3rrS9vWzvZl4_-jYmY0qFz-AgL1cqY</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>33190442</pqid></control><display><type>article</type><title>Temperature-dependent texture, stress and resistivity in melt spun Cu0.95Co0.05 ribbon</title><source>ScienceDirect Journals (5 years ago - present)</source><creator>MAJUMDAR, S ; SINGHA, R. K ; DAS, K ; CHAKRABORTY, M ; DAS, A. K ; RAY, S. K</creator><creatorcontrib>MAJUMDAR, S ; SINGHA, R. K ; DAS, K ; CHAKRABORTY, M ; DAS, A. K ; RAY, S. K</creatorcontrib><description>Ribbon samples of Cu0.95Co0.05 were prepared by melt spinning method to perform systematic investigations on structure and transport properties as a function of annealing temperature. X-ray diffraction study shows that the ribbon is polycrystalline with a strong &lt; 2 0 0 &gt; texture along the surface normal of the as-quenched Cu0.95Co0.05 ribbon and the degree of texture is enhanced upon annealing. The compressive stress, which relaxes upon annealing, is observed in as-quenched ribbon. The resistivity, which is higher in as-quenched ribbon, decreases toward the bulk value of Cu upon annealing. The compressive stress and higher resistivity in as-quenched ribbon are attributed to the incorporation of Co atoms/particles in Cu matrix. The decrement of the stress and resistivity upon annealing is due to the precipitation of Co atoms from the Cu matrix, segregating as Co or Co-rich Cu grains as observed from the transmission electron microscopy measurements.</description><identifier>ISSN: 0921-4526</identifier><identifier>EISSN: 1873-2135</identifier><identifier>DOI: 10.1016/j.physb.2007.11.030</identifier><language>eng</language><publisher>Amsterdam: Elsevier</publisher><subject>Cold working, work hardening; annealing, quenching, tempering, recovery, and recrystallization; textures ; Condensed matter: electronic structure, electrical, magnetic, and optical properties ; Cross-disciplinary physics: materials science; rheology ; Electrical and thermal conduction in crystalline metals and alloys ; Electronic conduction in metals and alloys ; Electronic transport in condensed matter ; Exact sciences and technology ; Materials science ; Physics ; Treatment of materials and its effects on microstructure and properties</subject><ispartof>Physica. B, Condensed matter, 2008-06, Vol.403 (12), p.2059-2064</ispartof><rights>2008 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c310t-39b9a1f0aa04683a39c4eff689ae922a5146e5716ca89630a2d9b67539bd14073</citedby><cites>FETCH-LOGICAL-c310t-39b9a1f0aa04683a39c4eff689ae922a5146e5716ca89630a2d9b67539bd14073</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,27922,27923</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&amp;idt=20309058$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>MAJUMDAR, S</creatorcontrib><creatorcontrib>SINGHA, R. K</creatorcontrib><creatorcontrib>DAS, K</creatorcontrib><creatorcontrib>CHAKRABORTY, M</creatorcontrib><creatorcontrib>DAS, A. K</creatorcontrib><creatorcontrib>RAY, S. K</creatorcontrib><title>Temperature-dependent texture, stress and resistivity in melt spun Cu0.95Co0.05 ribbon</title><title>Physica. B, Condensed matter</title><description>Ribbon samples of Cu0.95Co0.05 were prepared by melt spinning method to perform systematic investigations on structure and transport properties as a function of annealing temperature. X-ray diffraction study shows that the ribbon is polycrystalline with a strong &lt; 2 0 0 &gt; texture along the surface normal of the as-quenched Cu0.95Co0.05 ribbon and the degree of texture is enhanced upon annealing. The compressive stress, which relaxes upon annealing, is observed in as-quenched ribbon. The resistivity, which is higher in as-quenched ribbon, decreases toward the bulk value of Cu upon annealing. The compressive stress and higher resistivity in as-quenched ribbon are attributed to the incorporation of Co atoms/particles in Cu matrix. The decrement of the stress and resistivity upon annealing is due to the precipitation of Co atoms from the Cu matrix, segregating as Co or Co-rich Cu grains as observed from the transmission electron microscopy measurements.</description><subject>Cold working, work hardening; annealing, quenching, tempering, recovery, and recrystallization; textures</subject><subject>Condensed matter: electronic structure, electrical, magnetic, and optical properties</subject><subject>Cross-disciplinary physics: materials science; rheology</subject><subject>Electrical and thermal conduction in crystalline metals and alloys</subject><subject>Electronic conduction in metals and alloys</subject><subject>Electronic transport in condensed matter</subject><subject>Exact sciences and technology</subject><subject>Materials science</subject><subject>Physics</subject><subject>Treatment of materials and its effects on microstructure and properties</subject><issn>0921-4526</issn><issn>1873-2135</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2008</creationdate><recordtype>article</recordtype><recordid>eNo9kMtOwzAQRS0EEqXwBWy8gRUJM3acxEtU8ZIqsSlsLSeZiFR5YTuI_j0prZjNjEbn3sVh7BohRsD0fhuPnztfxAIgixFjkHDCFphnMhIo1SlbgBYYJUqk5-zC-y3Mgxku2MeGupGcDZOjqKKR-or6wAP97D933AdH3nPbV3w-Gh-a7ybseNPzjtrA_Tj1fDVBrNVqgBgUd01RDP0lO6tt6-nquJfs_elxs3qJ1m_Pr6uHdVRKhBBJXWiLNVgLSZpLK3WZUF2nubakhbAKk5RUhmlpc51KsKLSRZqpOVdhAplcsttD7-iGr4l8MF3jS2pb29MweSMlakgSMYPyAJZu8N5RbUbXdNbtDILZOzRb8-fQ7B0aRDM7nFM3x3rrS9vWzvZl4_-jYmY0qFz-AgL1cqY</recordid><startdate>20080601</startdate><enddate>20080601</enddate><creator>MAJUMDAR, S</creator><creator>SINGHA, R. K</creator><creator>DAS, K</creator><creator>CHAKRABORTY, M</creator><creator>DAS, A. K</creator><creator>RAY, S. K</creator><general>Elsevier</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7U5</scope><scope>8BQ</scope><scope>8FD</scope><scope>H8G</scope><scope>JG9</scope><scope>L7M</scope></search><sort><creationdate>20080601</creationdate><title>Temperature-dependent texture, stress and resistivity in melt spun Cu0.95Co0.05 ribbon</title><author>MAJUMDAR, S ; SINGHA, R. K ; DAS, K ; CHAKRABORTY, M ; DAS, A. K ; RAY, S. K</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c310t-39b9a1f0aa04683a39c4eff689ae922a5146e5716ca89630a2d9b67539bd14073</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2008</creationdate><topic>Cold working, work hardening; annealing, quenching, tempering, recovery, and recrystallization; textures</topic><topic>Condensed matter: electronic structure, electrical, magnetic, and optical properties</topic><topic>Cross-disciplinary physics: materials science; rheology</topic><topic>Electrical and thermal conduction in crystalline metals and alloys</topic><topic>Electronic conduction in metals and alloys</topic><topic>Electronic transport in condensed matter</topic><topic>Exact sciences and technology</topic><topic>Materials science</topic><topic>Physics</topic><topic>Treatment of materials and its effects on microstructure and properties</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>MAJUMDAR, S</creatorcontrib><creatorcontrib>SINGHA, R. K</creatorcontrib><creatorcontrib>DAS, K</creatorcontrib><creatorcontrib>CHAKRABORTY, M</creatorcontrib><creatorcontrib>DAS, A. K</creatorcontrib><creatorcontrib>RAY, S. K</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Copper Technical Reference Library</collection><collection>Materials Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Physica. B, Condensed matter</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>MAJUMDAR, S</au><au>SINGHA, R. K</au><au>DAS, K</au><au>CHAKRABORTY, M</au><au>DAS, A. K</au><au>RAY, S. K</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Temperature-dependent texture, stress and resistivity in melt spun Cu0.95Co0.05 ribbon</atitle><jtitle>Physica. B, Condensed matter</jtitle><date>2008-06-01</date><risdate>2008</risdate><volume>403</volume><issue>12</issue><spage>2059</spage><epage>2064</epage><pages>2059-2064</pages><issn>0921-4526</issn><eissn>1873-2135</eissn><abstract>Ribbon samples of Cu0.95Co0.05 were prepared by melt spinning method to perform systematic investigations on structure and transport properties as a function of annealing temperature. X-ray diffraction study shows that the ribbon is polycrystalline with a strong &lt; 2 0 0 &gt; texture along the surface normal of the as-quenched Cu0.95Co0.05 ribbon and the degree of texture is enhanced upon annealing. The compressive stress, which relaxes upon annealing, is observed in as-quenched ribbon. The resistivity, which is higher in as-quenched ribbon, decreases toward the bulk value of Cu upon annealing. The compressive stress and higher resistivity in as-quenched ribbon are attributed to the incorporation of Co atoms/particles in Cu matrix. The decrement of the stress and resistivity upon annealing is due to the precipitation of Co atoms from the Cu matrix, segregating as Co or Co-rich Cu grains as observed from the transmission electron microscopy measurements.</abstract><cop>Amsterdam</cop><pub>Elsevier</pub><doi>10.1016/j.physb.2007.11.030</doi><tpages>6</tpages></addata></record>
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source ScienceDirect Journals (5 years ago - present)
subjects Cold working, work hardening
annealing, quenching, tempering, recovery, and recrystallization
textures
Condensed matter: electronic structure, electrical, magnetic, and optical properties
Cross-disciplinary physics: materials science
rheology
Electrical and thermal conduction in crystalline metals and alloys
Electronic conduction in metals and alloys
Electronic transport in condensed matter
Exact sciences and technology
Materials science
Physics
Treatment of materials and its effects on microstructure and properties
title Temperature-dependent texture, stress and resistivity in melt spun Cu0.95Co0.05 ribbon
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-10T09%3A34%3A38IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Temperature-dependent%20texture,%20stress%20and%20resistivity%20in%20melt%20spun%20Cu0.95Co0.05%20ribbon&rft.jtitle=Physica.%20B,%20Condensed%20matter&rft.au=MAJUMDAR,%20S&rft.date=2008-06-01&rft.volume=403&rft.issue=12&rft.spage=2059&rft.epage=2064&rft.pages=2059-2064&rft.issn=0921-4526&rft.eissn=1873-2135&rft_id=info:doi/10.1016/j.physb.2007.11.030&rft_dat=%3Cproquest_cross%3E33190442%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=33190442&rft_id=info:pmid/&rfr_iscdi=true