Passivation cracking analysis of integrated-circuit microstructures under aeronautical conditions

Passivation cracking is one of the main failures of integrated circuits (ICs). A major cause for these failures is the mismatch of thermal expansion coefficients, Young's modulus, and Poisson's ratios of the package materials. Here, the finite element simulations and the maximum principal...

Ausführliche Beschreibung

Bibliographische Detailangaben

Veröffentlicht in:	Materials science & engineering. A, Structural materials : properties, microstructure and processing Structural materials : properties, microstructure and processing, 2008-06, Vol.483, p.340-342
Hauptverfasser:	He, Yuting, Li, Hongpeng, Zhang, Hengxi, Li, Feng, Fan, Chaohua
Format:	Artikel
Sprache:	eng
Schlagworte:	Aeronautical conditions Condensed matter: structure, mechanical and thermal properties Exact sciences and technology Fatigue, brittleness, fracture, and cracks Maximum principal stress Mechanical and acoustical properties of condensed matter Mechanical properties of solids Passivation crack Physics
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!