Effects of Co addition in eutectic Sn–3.5Ag solder on shear strength and microstructural development

In this study, the approach of composite solder using eutectic Sn–3.5Ag solder and Co was tried. Co particles and Sn–3.5Ag solder paste were mechanically mixed at Co weight fractions from 0.1% to 2.0%. For the Co-mixed Sn–3.5Ag solder pastes, their melting temperatures and spreading areas were measu...

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Veröffentlicht in:	Microelectronic engineering 2008-07, Vol.85 (7), p.1577-1583
Hauptverfasser:	Lee, Jung-Sub, Chu, Kun-Mo, Patzelt, Rainer, Manessis, Dionysios, Ostmann, Andreas, Jeon, Duk Young
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Co addition Composite solder Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology Integrated circuits Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Sn–3.5Ag
Online-Zugang:	Volltext
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