Effects of Co addition in eutectic Sn–3.5Ag solder on shear strength and microstructural development
In this study, the approach of composite solder using eutectic Sn–3.5Ag solder and Co was tried. Co particles and Sn–3.5Ag solder paste were mechanically mixed at Co weight fractions from 0.1% to 2.0%. For the Co-mixed Sn–3.5Ag solder pastes, their melting temperatures and spreading areas were measu...
Gespeichert in:
| Veröffentlicht in: | Microelectronic engineering 2008-07, Vol.85 (7), p.1577-1583 |
|---|---|
| Hauptverfasser: | , , , , , |
| Format: | Artikel |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 1583 |
|---|---|
| container_issue | 7 |
| container_start_page | 1577 |
| container_title | Microelectronic engineering |
| container_volume | 85 |
| creator | Lee, Jung-Sub Chu, Kun-Mo Patzelt, Rainer Manessis, Dionysios Ostmann, Andreas Jeon, Duk Young |
| description | In this study, the approach of composite solder using eutectic Sn–3.5Ag solder and Co was tried. Co particles and Sn–3.5Ag solder paste were mechanically mixed at Co weight fractions from 0.1% to 2.0%. For the Co-mixed Sn–3.5Ag solder pastes, their melting temperatures and spreading areas were measured. The solder pastes were stencil printed on test substrates and reflowed to form solder bumps. Ball shear test was performed to examine shear strength of Co-reinforced Sn–3.5Ag solder bumps. As a result, Co addition up to 2
wt.% did not alter the melting temperature under heating but reduced undercooling. The maximum shear strength of Co-reinforced Sn–3.5Ag solder bumps increased by 28% compared to normal ones. The increase in shear strength can be attributed to the (Cu,Co)
3Sn
2 intermetallic compounds. |
| doi_str_mv | 10.1016/j.mee.2008.03.002 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_32897119</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><els_id>S0167931708001433</els_id><sourcerecordid>32897119</sourcerecordid><originalsourceid>FETCH-LOGICAL-c358t-11b39e5d1710c385115163aa0938cdfc97153a32ca4bc089c03b200f8d2c4d6f3</originalsourceid><addsrcrecordid>eNp9kLFuHCEQhlFkSznbeYB0NHG3G2Y5dlm5sk6OHclSCsc14mCwOe3CBVhL6fwOeUM_STidlTIVGuabH-Yj5DOwFhj0X3ftjNh2jMmW8Zax7gNZgRx4I0QvT8iqMkMzchg-krOcd6zWayZXxN04h6ZkGh3dRKqt9cXHQH2guJTa8YY-hLfXP7wV1080x8liohXIz6gTzSVheCrPVAdLZ29SrDeLKUvSE7X4glPczxjKBTl1esr46f08J4_fbn5u7pr7H7ffN9f3jeFClgZgy0cUFgZghksBIKDnWrORS2OdGQcQXPPO6PXWMDkaxrd1ZydtZ9a2d_ycXB5z9yn-WjAXNftscJp0wLhkxTtZM2CsIBzBw5dzQqf2yc86_VbA1MGo2qlqVB2MKsZVNVpnvryH62z05JIOxud_gx0TDEbZV-7qyGHd9MVjUtl4DAatT9WostH_55W_B1-MQQ</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>32897119</pqid></control><display><type>article</type><title>Effects of Co addition in eutectic Sn–3.5Ag solder on shear strength and microstructural development</title><source>Elsevier ScienceDirect Journals Complete</source><creator>Lee, Jung-Sub ; Chu, Kun-Mo ; Patzelt, Rainer ; Manessis, Dionysios ; Ostmann, Andreas ; Jeon, Duk Young</creator><creatorcontrib>Lee, Jung-Sub ; Chu, Kun-Mo ; Patzelt, Rainer ; Manessis, Dionysios ; Ostmann, Andreas ; Jeon, Duk Young</creatorcontrib><description>In this study, the approach of composite solder using eutectic Sn–3.5Ag solder and Co was tried. Co particles and Sn–3.5Ag solder paste were mechanically mixed at Co weight fractions from 0.1% to 2.0%. For the Co-mixed Sn–3.5Ag solder pastes, their melting temperatures and spreading areas were measured. The solder pastes were stencil printed on test substrates and reflowed to form solder bumps. Ball shear test was performed to examine shear strength of Co-reinforced Sn–3.5Ag solder bumps. As a result, Co addition up to 2
wt.% did not alter the melting temperature under heating but reduced undercooling. The maximum shear strength of Co-reinforced Sn–3.5Ag solder bumps increased by 28% compared to normal ones. The increase in shear strength can be attributed to the (Cu,Co)
3Sn
2 intermetallic compounds.</description><identifier>ISSN: 0167-9317</identifier><identifier>EISSN: 1873-5568</identifier><identifier>DOI: 10.1016/j.mee.2008.03.002</identifier><identifier>CODEN: MIENEF</identifier><language>eng</language><publisher>Amsterdam: Elsevier B.V</publisher><subject>Applied sciences ; Co addition ; Composite solder ; Design. Technologies. Operation analysis. Testing ; Electronics ; Exact sciences and technology ; Integrated circuits ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; Sn–3.5Ag</subject><ispartof>Microelectronic engineering, 2008-07, Vol.85 (7), p.1577-1583</ispartof><rights>2008 Elsevier B.V.</rights><rights>2008 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c358t-11b39e5d1710c385115163aa0938cdfc97153a32ca4bc089c03b200f8d2c4d6f3</citedby><cites>FETCH-LOGICAL-c358t-11b39e5d1710c385115163aa0938cdfc97153a32ca4bc089c03b200f8d2c4d6f3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/j.mee.2008.03.002$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,780,784,3548,27923,27924,45994</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=20501986$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Lee, Jung-Sub</creatorcontrib><creatorcontrib>Chu, Kun-Mo</creatorcontrib><creatorcontrib>Patzelt, Rainer</creatorcontrib><creatorcontrib>Manessis, Dionysios</creatorcontrib><creatorcontrib>Ostmann, Andreas</creatorcontrib><creatorcontrib>Jeon, Duk Young</creatorcontrib><title>Effects of Co addition in eutectic Sn–3.5Ag solder on shear strength and microstructural development</title><title>Microelectronic engineering</title><description>In this study, the approach of composite solder using eutectic Sn–3.5Ag solder and Co was tried. Co particles and Sn–3.5Ag solder paste were mechanically mixed at Co weight fractions from 0.1% to 2.0%. For the Co-mixed Sn–3.5Ag solder pastes, their melting temperatures and spreading areas were measured. The solder pastes were stencil printed on test substrates and reflowed to form solder bumps. Ball shear test was performed to examine shear strength of Co-reinforced Sn–3.5Ag solder bumps. As a result, Co addition up to 2
wt.% did not alter the melting temperature under heating but reduced undercooling. The maximum shear strength of Co-reinforced Sn–3.5Ag solder bumps increased by 28% compared to normal ones. The increase in shear strength can be attributed to the (Cu,Co)
3Sn
2 intermetallic compounds.</description><subject>Applied sciences</subject><subject>Co addition</subject><subject>Composite solder</subject><subject>Design. Technologies. Operation analysis. Testing</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Integrated circuits</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>Sn–3.5Ag</subject><issn>0167-9317</issn><issn>1873-5568</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2008</creationdate><recordtype>article</recordtype><recordid>eNp9kLFuHCEQhlFkSznbeYB0NHG3G2Y5dlm5sk6OHclSCsc14mCwOe3CBVhL6fwOeUM_STidlTIVGuabH-Yj5DOwFhj0X3ftjNh2jMmW8Zax7gNZgRx4I0QvT8iqMkMzchg-krOcd6zWayZXxN04h6ZkGh3dRKqt9cXHQH2guJTa8YY-hLfXP7wV1080x8liohXIz6gTzSVheCrPVAdLZ29SrDeLKUvSE7X4glPczxjKBTl1esr46f08J4_fbn5u7pr7H7ffN9f3jeFClgZgy0cUFgZghksBIKDnWrORS2OdGQcQXPPO6PXWMDkaxrd1ZydtZ9a2d_ycXB5z9yn-WjAXNftscJp0wLhkxTtZM2CsIBzBw5dzQqf2yc86_VbA1MGo2qlqVB2MKsZVNVpnvryH62z05JIOxud_gx0TDEbZV-7qyGHd9MVjUtl4DAatT9WostH_55W_B1-MQQ</recordid><startdate>20080701</startdate><enddate>20080701</enddate><creator>Lee, Jung-Sub</creator><creator>Chu, Kun-Mo</creator><creator>Patzelt, Rainer</creator><creator>Manessis, Dionysios</creator><creator>Ostmann, Andreas</creator><creator>Jeon, Duk Young</creator><general>Elsevier B.V</general><general>Elsevier Science</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope></search><sort><creationdate>20080701</creationdate><title>Effects of Co addition in eutectic Sn–3.5Ag solder on shear strength and microstructural development</title><author>Lee, Jung-Sub ; Chu, Kun-Mo ; Patzelt, Rainer ; Manessis, Dionysios ; Ostmann, Andreas ; Jeon, Duk Young</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c358t-11b39e5d1710c385115163aa0938cdfc97153a32ca4bc089c03b200f8d2c4d6f3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2008</creationdate><topic>Applied sciences</topic><topic>Co addition</topic><topic>Composite solder</topic><topic>Design. Technologies. Operation analysis. Testing</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Integrated circuits</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>Sn–3.5Ag</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Lee, Jung-Sub</creatorcontrib><creatorcontrib>Chu, Kun-Mo</creatorcontrib><creatorcontrib>Patzelt, Rainer</creatorcontrib><creatorcontrib>Manessis, Dionysios</creatorcontrib><creatorcontrib>Ostmann, Andreas</creatorcontrib><creatorcontrib>Jeon, Duk Young</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Microelectronic engineering</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Lee, Jung-Sub</au><au>Chu, Kun-Mo</au><au>Patzelt, Rainer</au><au>Manessis, Dionysios</au><au>Ostmann, Andreas</au><au>Jeon, Duk Young</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Effects of Co addition in eutectic Sn–3.5Ag solder on shear strength and microstructural development</atitle><jtitle>Microelectronic engineering</jtitle><date>2008-07-01</date><risdate>2008</risdate><volume>85</volume><issue>7</issue><spage>1577</spage><epage>1583</epage><pages>1577-1583</pages><issn>0167-9317</issn><eissn>1873-5568</eissn><coden>MIENEF</coden><abstract>In this study, the approach of composite solder using eutectic Sn–3.5Ag solder and Co was tried. Co particles and Sn–3.5Ag solder paste were mechanically mixed at Co weight fractions from 0.1% to 2.0%. For the Co-mixed Sn–3.5Ag solder pastes, their melting temperatures and spreading areas were measured. The solder pastes were stencil printed on test substrates and reflowed to form solder bumps. Ball shear test was performed to examine shear strength of Co-reinforced Sn–3.5Ag solder bumps. As a result, Co addition up to 2
wt.% did not alter the melting temperature under heating but reduced undercooling. The maximum shear strength of Co-reinforced Sn–3.5Ag solder bumps increased by 28% compared to normal ones. The increase in shear strength can be attributed to the (Cu,Co)
3Sn
2 intermetallic compounds.</abstract><cop>Amsterdam</cop><pub>Elsevier B.V</pub><doi>10.1016/j.mee.2008.03.002</doi><tpages>7</tpages></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 0167-9317 |
| ispartof | Microelectronic engineering, 2008-07, Vol.85 (7), p.1577-1583 |
| issn | 0167-9317 1873-5568 |
| language | eng |
| recordid | cdi_proquest_miscellaneous_32897119 |
| source | Elsevier ScienceDirect Journals Complete |
| subjects | Applied sciences Co addition Composite solder Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology Integrated circuits Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Sn–3.5Ag |
| title | Effects of Co addition in eutectic Sn–3.5Ag solder on shear strength and microstructural development |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-10T09%3A48%3A43IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Effects%20of%20Co%20addition%20in%20eutectic%20Sn%E2%80%933.5Ag%20solder%20on%20shear%20strength%20and%20microstructural%20development&rft.jtitle=Microelectronic%20engineering&rft.au=Lee,%20Jung-Sub&rft.date=2008-07-01&rft.volume=85&rft.issue=7&rft.spage=1577&rft.epage=1583&rft.pages=1577-1583&rft.issn=0167-9317&rft.eissn=1873-5568&rft.coden=MIENEF&rft_id=info:doi/10.1016/j.mee.2008.03.002&rft_dat=%3Cproquest_cross%3E32897119%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=32897119&rft_id=info:pmid/&rft_els_id=S0167931708001433&rfr_iscdi=true |