Effect of reflow numbers on the interfacial reaction and shear strength of flip chip solder joints
The effects of multiple reflows on the microstructural variation and joint strength of the flip chip solder joints were investigated. Conventional Sn–37Pb and a representative Pb-free Sn–3.0Ag–0.5Cu were used, and a popular low cost under bump metallurgy (UBM) of immersion Au/electroless Ni–P platin...
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| Veröffentlicht in: | Journal of alloys and compounds 2008-06, Vol.458 (1), p.253-260 |
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| container_title | Journal of alloys and compounds |
| container_volume | 458 |
| creator | Kim, Dae-Gon Kim, Jong-Woong Ha, Sang-Su Noh, Bo-In Koo, Ja-Myeong Park, Dong-Woon Ko, Myung-Wan Jung, Seung-Boo |
| description | The effects of multiple reflows on the microstructural variation and joint strength of the flip chip solder joints were investigated. Conventional Sn–37Pb and a representative Pb-free Sn–3.0Ag–0.5Cu were used, and a popular low cost under bump metallurgy (UBM) of immersion Au/electroless Ni–P plating was employed. In case of Sn–37Pb, only Ni
3Sn
4 intermetallic compound layer was formed during multiple reflows. In case of Sn–3.0Ag–0.5Cu, (Cu,Ni)
6Sn
5 intermetallic compound layer was observed after a single reflow, while (Ni,Cu)
3Sn
4 layer was additionally settled at the interface between the (Cu,Ni)
6Sn
5 layer and Ni–P UBM. The thicknesses of the intermetallic compound layers increased and coarsened. The shear force of the both joints slightly decreased during the multiple reflows. The decrease of the joint strength was caused by different softening phenomena between the two cases, and that is discussed in the main text. |
| doi_str_mv | 10.1016/j.jallcom.2007.04.042 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_32828462</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><els_id>S0925838807008511</els_id><sourcerecordid>32828462</sourcerecordid><originalsourceid>FETCH-LOGICAL-c436t-d39346a3011e150aae61ee3ef80a094aec76db441efc20382fee0271f148543c3</originalsourceid><addsrcrecordid>eNqFkE1rGzEQhkVpIW7SnxDQpbmtM_rYXe2phJA2gUAvzVmMtaNYi7xypXVL_31kbHoNDDOHed75eBm7FrAWILrbaT1hjC7t1hKgX4OuIT-wlTC9anTXDR_ZCgbZNkYZc8E-lzIBgBiUWLHNg_fkFp48z-Rj-svnw25DufA082VLPMwLZY8uYKwEuiXUBs4jL1vCzMuSaX5dtscBPoY9d9uaSoojZT6lqi5X7JPHWOjLuV6yl-8Pv-4fm-efP57u754bp1W3NKMalO5QgRAkWkCkThAp8gYQBo3k-m7caC3IOwnKSE8EshdeaNNq5dQluznN3ef0-0BlsbtQHMWIM6VDsUoaaXQnK9ieQJdTKfVtu89hh_mfFWCPjtrJnh21R0ct6BpH3dfzAiwOo884u1D-i-tR2pi-rdy3E0f12z-Bsi0u0OxoDLl6bccU3tn0BhM_j7Q</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>32828462</pqid></control><display><type>article</type><title>Effect of reflow numbers on the interfacial reaction and shear strength of flip chip solder joints</title><source>Elsevier ScienceDirect Journals Complete</source><creator>Kim, Dae-Gon ; Kim, Jong-Woong ; Ha, Sang-Su ; Noh, Bo-In ; Koo, Ja-Myeong ; Park, Dong-Woon ; Ko, Myung-Wan ; Jung, Seung-Boo</creator><creatorcontrib>Kim, Dae-Gon ; Kim, Jong-Woong ; Ha, Sang-Su ; Noh, Bo-In ; Koo, Ja-Myeong ; Park, Dong-Woon ; Ko, Myung-Wan ; Jung, Seung-Boo</creatorcontrib><description>The effects of multiple reflows on the microstructural variation and joint strength of the flip chip solder joints were investigated. Conventional Sn–37Pb and a representative Pb-free Sn–3.0Ag–0.5Cu were used, and a popular low cost under bump metallurgy (UBM) of immersion Au/electroless Ni–P plating was employed. In case of Sn–37Pb, only Ni
3Sn
4 intermetallic compound layer was formed during multiple reflows. In case of Sn–3.0Ag–0.5Cu, (Cu,Ni)
6Sn
5 intermetallic compound layer was observed after a single reflow, while (Ni,Cu)
3Sn
4 layer was additionally settled at the interface between the (Cu,Ni)
6Sn
5 layer and Ni–P UBM. The thicknesses of the intermetallic compound layers increased and coarsened. The shear force of the both joints slightly decreased during the multiple reflows. The decrease of the joint strength was caused by different softening phenomena between the two cases, and that is discussed in the main text.</description><identifier>ISSN: 0925-8388</identifier><identifier>EISSN: 1873-4669</identifier><identifier>DOI: 10.1016/j.jallcom.2007.04.042</identifier><language>eng</language><publisher>Lausanne: Elsevier B.V</publisher><subject>Applied sciences ; Brazing. Soldering ; Exact sciences and technology ; Flip chip ; Interfacial reaction ; Joining, thermal cutting: metallurgical aspects ; Metals. Metallurgy ; Shear force ; Sn–3.0Ag–0.5Cu ; Sn–37Pb</subject><ispartof>Journal of alloys and compounds, 2008-06, Vol.458 (1), p.253-260</ispartof><rights>2007 Elsevier B.V.</rights><rights>2008 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c436t-d39346a3011e150aae61ee3ef80a094aec76db441efc20382fee0271f148543c3</citedby><cites>FETCH-LOGICAL-c436t-d39346a3011e150aae61ee3ef80a094aec76db441efc20382fee0271f148543c3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/j.jallcom.2007.04.042$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>315,781,785,3551,27928,27929,45999</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=20348875$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Kim, Dae-Gon</creatorcontrib><creatorcontrib>Kim, Jong-Woong</creatorcontrib><creatorcontrib>Ha, Sang-Su</creatorcontrib><creatorcontrib>Noh, Bo-In</creatorcontrib><creatorcontrib>Koo, Ja-Myeong</creatorcontrib><creatorcontrib>Park, Dong-Woon</creatorcontrib><creatorcontrib>Ko, Myung-Wan</creatorcontrib><creatorcontrib>Jung, Seung-Boo</creatorcontrib><title>Effect of reflow numbers on the interfacial reaction and shear strength of flip chip solder joints</title><title>Journal of alloys and compounds</title><description>The effects of multiple reflows on the microstructural variation and joint strength of the flip chip solder joints were investigated. Conventional Sn–37Pb and a representative Pb-free Sn–3.0Ag–0.5Cu were used, and a popular low cost under bump metallurgy (UBM) of immersion Au/electroless Ni–P plating was employed. In case of Sn–37Pb, only Ni
3Sn
4 intermetallic compound layer was formed during multiple reflows. In case of Sn–3.0Ag–0.5Cu, (Cu,Ni)
6Sn
5 intermetallic compound layer was observed after a single reflow, while (Ni,Cu)
3Sn
4 layer was additionally settled at the interface between the (Cu,Ni)
6Sn
5 layer and Ni–P UBM. The thicknesses of the intermetallic compound layers increased and coarsened. The shear force of the both joints slightly decreased during the multiple reflows. The decrease of the joint strength was caused by different softening phenomena between the two cases, and that is discussed in the main text.</description><subject>Applied sciences</subject><subject>Brazing. Soldering</subject><subject>Exact sciences and technology</subject><subject>Flip chip</subject><subject>Interfacial reaction</subject><subject>Joining, thermal cutting: metallurgical aspects</subject><subject>Metals. Metallurgy</subject><subject>Shear force</subject><subject>Sn–3.0Ag–0.5Cu</subject><subject>Sn–37Pb</subject><issn>0925-8388</issn><issn>1873-4669</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2008</creationdate><recordtype>article</recordtype><recordid>eNqFkE1rGzEQhkVpIW7SnxDQpbmtM_rYXe2phJA2gUAvzVmMtaNYi7xypXVL_31kbHoNDDOHed75eBm7FrAWILrbaT1hjC7t1hKgX4OuIT-wlTC9anTXDR_ZCgbZNkYZc8E-lzIBgBiUWLHNg_fkFp48z-Rj-svnw25DufA082VLPMwLZY8uYKwEuiXUBs4jL1vCzMuSaX5dtscBPoY9d9uaSoojZT6lqi5X7JPHWOjLuV6yl-8Pv-4fm-efP57u754bp1W3NKMalO5QgRAkWkCkThAp8gYQBo3k-m7caC3IOwnKSE8EshdeaNNq5dQluznN3ef0-0BlsbtQHMWIM6VDsUoaaXQnK9ieQJdTKfVtu89hh_mfFWCPjtrJnh21R0ct6BpH3dfzAiwOo884u1D-i-tR2pi-rdy3E0f12z-Bsi0u0OxoDLl6bccU3tn0BhM_j7Q</recordid><startdate>20080630</startdate><enddate>20080630</enddate><creator>Kim, Dae-Gon</creator><creator>Kim, Jong-Woong</creator><creator>Ha, Sang-Su</creator><creator>Noh, Bo-In</creator><creator>Koo, Ja-Myeong</creator><creator>Park, Dong-Woon</creator><creator>Ko, Myung-Wan</creator><creator>Jung, Seung-Boo</creator><general>Elsevier B.V</general><general>Elsevier</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>20080630</creationdate><title>Effect of reflow numbers on the interfacial reaction and shear strength of flip chip solder joints</title><author>Kim, Dae-Gon ; Kim, Jong-Woong ; Ha, Sang-Su ; Noh, Bo-In ; Koo, Ja-Myeong ; Park, Dong-Woon ; Ko, Myung-Wan ; Jung, Seung-Boo</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c436t-d39346a3011e150aae61ee3ef80a094aec76db441efc20382fee0271f148543c3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2008</creationdate><topic>Applied sciences</topic><topic>Brazing. Soldering</topic><topic>Exact sciences and technology</topic><topic>Flip chip</topic><topic>Interfacial reaction</topic><topic>Joining, thermal cutting: metallurgical aspects</topic><topic>Metals. Metallurgy</topic><topic>Shear force</topic><topic>Sn–3.0Ag–0.5Cu</topic><topic>Sn–37Pb</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Kim, Dae-Gon</creatorcontrib><creatorcontrib>Kim, Jong-Woong</creatorcontrib><creatorcontrib>Ha, Sang-Su</creatorcontrib><creatorcontrib>Noh, Bo-In</creatorcontrib><creatorcontrib>Koo, Ja-Myeong</creatorcontrib><creatorcontrib>Park, Dong-Woon</creatorcontrib><creatorcontrib>Ko, Myung-Wan</creatorcontrib><creatorcontrib>Jung, Seung-Boo</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Journal of alloys and compounds</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Kim, Dae-Gon</au><au>Kim, Jong-Woong</au><au>Ha, Sang-Su</au><au>Noh, Bo-In</au><au>Koo, Ja-Myeong</au><au>Park, Dong-Woon</au><au>Ko, Myung-Wan</au><au>Jung, Seung-Boo</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Effect of reflow numbers on the interfacial reaction and shear strength of flip chip solder joints</atitle><jtitle>Journal of alloys and compounds</jtitle><date>2008-06-30</date><risdate>2008</risdate><volume>458</volume><issue>1</issue><spage>253</spage><epage>260</epage><pages>253-260</pages><issn>0925-8388</issn><eissn>1873-4669</eissn><abstract>The effects of multiple reflows on the microstructural variation and joint strength of the flip chip solder joints were investigated. Conventional Sn–37Pb and a representative Pb-free Sn–3.0Ag–0.5Cu were used, and a popular low cost under bump metallurgy (UBM) of immersion Au/electroless Ni–P plating was employed. In case of Sn–37Pb, only Ni
3Sn
4 intermetallic compound layer was formed during multiple reflows. In case of Sn–3.0Ag–0.5Cu, (Cu,Ni)
6Sn
5 intermetallic compound layer was observed after a single reflow, while (Ni,Cu)
3Sn
4 layer was additionally settled at the interface between the (Cu,Ni)
6Sn
5 layer and Ni–P UBM. The thicknesses of the intermetallic compound layers increased and coarsened. The shear force of the both joints slightly decreased during the multiple reflows. The decrease of the joint strength was caused by different softening phenomena between the two cases, and that is discussed in the main text.</abstract><cop>Lausanne</cop><pub>Elsevier B.V</pub><doi>10.1016/j.jallcom.2007.04.042</doi><tpages>8</tpages></addata></record> |
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| ispartof | Journal of alloys and compounds, 2008-06, Vol.458 (1), p.253-260 |
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| language | eng |
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| source | Elsevier ScienceDirect Journals Complete |
| subjects | Applied sciences Brazing. Soldering Exact sciences and technology Flip chip Interfacial reaction Joining, thermal cutting: metallurgical aspects Metals. Metallurgy Shear force Sn–3.0Ag–0.5Cu Sn–37Pb |
| title | Effect of reflow numbers on the interfacial reaction and shear strength of flip chip solder joints |
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