Stress corrosion of organosilicate glass films in aqueous environments: Role of pH
Subcritical cracking of thin glass films caused by stress-corrosion phenomena cannot be neglected when it comes to application and manufacturing processes that involve exposure to aqueous environments. A protocol is introduced to allow for a quantitative study of stress corrosion through channel cra...
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Veröffentlicht in: | Journal of materials research 2008-03, Vol.23 (3), p.862-868 |
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creator | Iacopi, F. Elia, C. Fournier, T. Sinapi, F. Travaly, Y. |
description | Subcritical cracking of thin glass films caused by stress-corrosion phenomena cannot be neglected when it comes to application and manufacturing processes that involve exposure to aqueous environments. A protocol is introduced to allow for a quantitative study of stress corrosion through channel cracking experiments. By this method, an exponential dependence of the crack propagation rate on the pH of the aqueous environment is revealed. Therefore, this behavior should be accounted for through the use of an appropriate pre-exponential factor in the expression of channel cracking rate. This factor should reflect the reduced crack resistance of the glass film caused by the weakening of the silica bonds behind the crack tip in the aqueous environment. A direct comparison between commercial slurries and reference solutions confirms that the crack resistance is a function of the pH of the ambient. |
doi_str_mv | 10.1557/JMR.2008.0108 |
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fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_32129972</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><cupid>10_1557_JMR_2008_0108</cupid><sourcerecordid>32129972</sourcerecordid><originalsourceid>FETCH-LOGICAL-c341t-9d9199ab1638749b6cf43e8a2631cceb554fee3a7d51d769f17e121e66401de33</originalsourceid><addsrcrecordid>eNqFkD1v2zAQhomgBeKmGbtr6iaHR1Kk2K0x8tHURWAnnQlaOhlMJdIh5aD596VgI1vQ6XDAc_d-EPIF6ByqSl3c_VrPGaX1nAKtT8iMUSHKijP5gcxoXYuSaRCn5FNKT5RCRZWYkfXDGDGlogkxhuSCL0JXhLi1Pm-9a-yIxba3mehcP6TC-cI-7zHsU4H-xcXgB_Rj-lasQ4_T7e72M_nY2T7h-XGekd_XV4-L23J5f_Nj8X1ZNlzAWOpWg9Z2A5LXSuiNbDrBsbZMcmga3FSV6BC5VW0FrZK6A4XAAKUUFFrk_Ix8PfzdxZAtpdEMLjXY99ZP_gxnwLRWLIPlAWxyxBSxM7voBhtfDVAzNWdyc2ZqzkzNZX5-4FPm_BajeQr76HOWdw-OAi6N-Pftu41_jFRcVUberMzP1YovgV6aReYvjobssImu3eL_FP4BLviOEg</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>32129972</pqid></control><display><type>article</type><title>Stress corrosion of organosilicate glass films in aqueous environments: Role of pH</title><source>SpringerLink Journals</source><creator>Iacopi, F. ; Elia, C. ; Fournier, T. ; Sinapi, F. ; Travaly, Y.</creator><creatorcontrib>Iacopi, F. ; Elia, C. ; Fournier, T. ; Sinapi, F. ; Travaly, Y.</creatorcontrib><description>Subcritical cracking of thin glass films caused by stress-corrosion phenomena cannot be neglected when it comes to application and manufacturing processes that involve exposure to aqueous environments. A protocol is introduced to allow for a quantitative study of stress corrosion through channel cracking experiments. By this method, an exponential dependence of the crack propagation rate on the pH of the aqueous environment is revealed. Therefore, this behavior should be accounted for through the use of an appropriate pre-exponential factor in the expression of channel cracking rate. This factor should reflect the reduced crack resistance of the glass film caused by the weakening of the silica bonds behind the crack tip in the aqueous environment. A direct comparison between commercial slurries and reference solutions confirms that the crack resistance is a function of the pH of the ambient.</description><identifier>ISSN: 0884-2914</identifier><identifier>EISSN: 2044-5326</identifier><identifier>DOI: 10.1557/JMR.2008.0108</identifier><language>eng</language><publisher>New York, USA: Cambridge University Press</publisher><subject>Amorphous ; Applied and Technical Physics ; Biomaterials ; Fracture ; Inorganic Chemistry ; Materials Engineering ; Materials Science ; Nanotechnology ; Thin film</subject><ispartof>Journal of materials research, 2008-03, Vol.23 (3), p.862-868</ispartof><rights>Copyright © Materials Research Society 2008</rights><rights>The Materials Research Society 2008</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><cites>FETCH-LOGICAL-c341t-9d9199ab1638749b6cf43e8a2631cceb554fee3a7d51d769f17e121e66401de33</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1557/JMR.2008.0108$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1557/JMR.2008.0108$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>314,777,781,27905,27906,41469,42538,51300</link.rule.ids></links><search><creatorcontrib>Iacopi, F.</creatorcontrib><creatorcontrib>Elia, C.</creatorcontrib><creatorcontrib>Fournier, T.</creatorcontrib><creatorcontrib>Sinapi, F.</creatorcontrib><creatorcontrib>Travaly, Y.</creatorcontrib><title>Stress corrosion of organosilicate glass films in aqueous environments: Role of pH</title><title>Journal of materials research</title><addtitle>Journal of Materials Research</addtitle><addtitle>J. Mater. Res</addtitle><description>Subcritical cracking of thin glass films caused by stress-corrosion phenomena cannot be neglected when it comes to application and manufacturing processes that involve exposure to aqueous environments. A protocol is introduced to allow for a quantitative study of stress corrosion through channel cracking experiments. By this method, an exponential dependence of the crack propagation rate on the pH of the aqueous environment is revealed. Therefore, this behavior should be accounted for through the use of an appropriate pre-exponential factor in the expression of channel cracking rate. This factor should reflect the reduced crack resistance of the glass film caused by the weakening of the silica bonds behind the crack tip in the aqueous environment. A direct comparison between commercial slurries and reference solutions confirms that the crack resistance is a function of the pH of the ambient.</description><subject>Amorphous</subject><subject>Applied and Technical Physics</subject><subject>Biomaterials</subject><subject>Fracture</subject><subject>Inorganic Chemistry</subject><subject>Materials Engineering</subject><subject>Materials Science</subject><subject>Nanotechnology</subject><subject>Thin film</subject><issn>0884-2914</issn><issn>2044-5326</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2008</creationdate><recordtype>article</recordtype><recordid>eNqFkD1v2zAQhomgBeKmGbtr6iaHR1Kk2K0x8tHURWAnnQlaOhlMJdIh5aD596VgI1vQ6XDAc_d-EPIF6ByqSl3c_VrPGaX1nAKtT8iMUSHKijP5gcxoXYuSaRCn5FNKT5RCRZWYkfXDGDGlogkxhuSCL0JXhLi1Pm-9a-yIxba3mehcP6TC-cI-7zHsU4H-xcXgB_Rj-lasQ4_T7e72M_nY2T7h-XGekd_XV4-L23J5f_Nj8X1ZNlzAWOpWg9Z2A5LXSuiNbDrBsbZMcmga3FSV6BC5VW0FrZK6A4XAAKUUFFrk_Ix8PfzdxZAtpdEMLjXY99ZP_gxnwLRWLIPlAWxyxBSxM7voBhtfDVAzNWdyc2ZqzkzNZX5-4FPm_BajeQr76HOWdw-OAi6N-Pftu41_jFRcVUberMzP1YovgV6aReYvjobssImu3eL_FP4BLviOEg</recordid><startdate>20080301</startdate><enddate>20080301</enddate><creator>Iacopi, F.</creator><creator>Elia, C.</creator><creator>Fournier, T.</creator><creator>Sinapi, F.</creator><creator>Travaly, Y.</creator><general>Cambridge University Press</general><general>Springer International Publishing</general><scope>BSCLL</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SE</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>20080301</creationdate><title>Stress corrosion of organosilicate glass films in aqueous environments: Role of pH</title><author>Iacopi, F. ; Elia, C. ; Fournier, T. ; Sinapi, F. ; Travaly, Y.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c341t-9d9199ab1638749b6cf43e8a2631cceb554fee3a7d51d769f17e121e66401de33</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2008</creationdate><topic>Amorphous</topic><topic>Applied and Technical Physics</topic><topic>Biomaterials</topic><topic>Fracture</topic><topic>Inorganic Chemistry</topic><topic>Materials Engineering</topic><topic>Materials Science</topic><topic>Nanotechnology</topic><topic>Thin film</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Iacopi, F.</creatorcontrib><creatorcontrib>Elia, C.</creatorcontrib><creatorcontrib>Fournier, T.</creatorcontrib><creatorcontrib>Sinapi, F.</creatorcontrib><creatorcontrib>Travaly, Y.</creatorcontrib><collection>Istex</collection><collection>CrossRef</collection><collection>Corrosion Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Journal of materials research</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Iacopi, F.</au><au>Elia, C.</au><au>Fournier, T.</au><au>Sinapi, F.</au><au>Travaly, Y.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Stress corrosion of organosilicate glass films in aqueous environments: Role of pH</atitle><jtitle>Journal of materials research</jtitle><stitle>Journal of Materials Research</stitle><addtitle>J. Mater. Res</addtitle><date>2008-03-01</date><risdate>2008</risdate><volume>23</volume><issue>3</issue><spage>862</spage><epage>868</epage><pages>862-868</pages><issn>0884-2914</issn><eissn>2044-5326</eissn><abstract>Subcritical cracking of thin glass films caused by stress-corrosion phenomena cannot be neglected when it comes to application and manufacturing processes that involve exposure to aqueous environments. A protocol is introduced to allow for a quantitative study of stress corrosion through channel cracking experiments. By this method, an exponential dependence of the crack propagation rate on the pH of the aqueous environment is revealed. Therefore, this behavior should be accounted for through the use of an appropriate pre-exponential factor in the expression of channel cracking rate. This factor should reflect the reduced crack resistance of the glass film caused by the weakening of the silica bonds behind the crack tip in the aqueous environment. A direct comparison between commercial slurries and reference solutions confirms that the crack resistance is a function of the pH of the ambient.</abstract><cop>New York, USA</cop><pub>Cambridge University Press</pub><doi>10.1557/JMR.2008.0108</doi><tpages>7</tpages><oa>free_for_read</oa></addata></record> |
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subjects | Amorphous Applied and Technical Physics Biomaterials Fracture Inorganic Chemistry Materials Engineering Materials Science Nanotechnology Thin film |
title | Stress corrosion of organosilicate glass films in aqueous environments: Role of pH |
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