A model system for the optimization of lamination parameters of PTFE-based dielectrics and metal surfaces
In microelectronic packaging, organic dielectric materials continue to displace ceramic materials because of cost, reduced weight, and performance advantages. Because thermosetting dielectric composites have long found widespread use in printed wiring board (PWB) fabrication, they have been the comp...
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| Veröffentlicht in: | Journal of materials science 2008-03, Vol.43 (6), p.2035-2045 |
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| creator | Matienzo, Luis J. Farquhar, Donald |
| description | In microelectronic packaging, organic dielectric materials continue to displace ceramic materials because of cost, reduced weight, and performance advantages. Because thermosetting dielectric composites have long found widespread use in printed wiring board (PWB) fabrication, they have been the components of choice for many organic chip carriers. Conversely, thermoplastic dielectrics, such as fluoropolymer (FP), and in particular poly(tetrafluoroethylene)-based dielectric composites (PTFE composites) have seldom found use in multilayer wiring packages in spite of their attractive electrical properties due to their processing challenges. In this paper, we report the use of a model system comprising pure PTFE film and Cr-coated copper surfaces to optimize the bonding process through lamination conditions for a fluoropolymer composite and chromium-coated copper surfaces and to study both the interface mechanics and its chemistry as a function of processing parameters. The significant finding of the investigation was the linkage between the macroscopic mechanical properties of the interface and the observable chemical alteration of the same under some lamination conditions. The relationship of the interface properties and the processing conditions extend a conceptual framework for the thermodynamics of the metal-polymer interface and the reliability of these electronic packages in their practical designs. |
| doi_str_mv | 10.1007/s10853-007-2426-8 |
| format | Article |
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Because thermosetting dielectric composites have long found widespread use in printed wiring board (PWB) fabrication, they have been the components of choice for many organic chip carriers. Conversely, thermoplastic dielectrics, such as fluoropolymer (FP), and in particular poly(tetrafluoroethylene)-based dielectric composites (PTFE composites) have seldom found use in multilayer wiring packages in spite of their attractive electrical properties due to their processing challenges. In this paper, we report the use of a model system comprising pure PTFE film and Cr-coated copper surfaces to optimize the bonding process through lamination conditions for a fluoropolymer composite and chromium-coated copper surfaces and to study both the interface mechanics and its chemistry as a function of processing parameters. The significant finding of the investigation was the linkage between the macroscopic mechanical properties of the interface and the observable chemical alteration of the same under some lamination conditions. The relationship of the interface properties and the processing conditions extend a conceptual framework for the thermodynamics of the metal-polymer interface and the reliability of these electronic packages in their practical designs.</description><identifier>ISSN: 0022-2461</identifier><identifier>EISSN: 1573-4803</identifier><identifier>DOI: 10.1007/s10853-007-2426-8</identifier><identifier>CODEN: JMTSAS</identifier><language>eng</language><publisher>New York: Springer US</publisher><subject>Applied sciences ; Characterization and Evaluation of Materials ; Chemistry and Materials Science ; Chip carriers ; Chromium ; Circuit boards ; Classical Mechanics ; Composite materials ; Composites ; Copper ; Crystallography and Scattering Methods ; Dielectrics ; Electrical properties ; Electronic packaging ; Electronics ; Exact sciences and technology ; Fluoropolymers ; Forms of application and semi-finished materials ; Interfacial properties ; Materials Science ; Mathematical models ; Mechanical properties ; Metal surfaces ; Microelectronic fabrication (materials and surfaces technology) ; Multilayers ; Optimization ; Organic chemistry ; Polymer industry, paints, wood ; Polymer matrix composites ; Polymer Sciences ; Polytetrafluoroethylene ; Polytetrafluoroethylenes ; Printed circuits ; Process parameters ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; Solid Mechanics ; Technology of polymers ; Weight reduction</subject><ispartof>Journal of materials science, 2008-03, Vol.43 (6), p.2035-2045</ispartof><rights>Springer Science+Business Media, LLC 2008</rights><rights>2008 INIST-CNRS</rights><rights>Journal of Materials Science is a copyright of Springer, (2008). All Rights Reserved.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c410t-145265a6bdf3e8079f617c5fcb6f6b0530ed643bfc11a644ccaf0086c818f683</citedby><cites>FETCH-LOGICAL-c410t-145265a6bdf3e8079f617c5fcb6f6b0530ed643bfc11a644ccaf0086c818f683</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s10853-007-2426-8$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s10853-007-2426-8$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>315,781,785,27926,27927,41490,42559,51321</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=20145545$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Matienzo, Luis J.</creatorcontrib><creatorcontrib>Farquhar, Donald</creatorcontrib><title>A model system for the optimization of lamination parameters of PTFE-based dielectrics and metal surfaces</title><title>Journal of materials science</title><addtitle>J Mater Sci</addtitle><description>In microelectronic packaging, organic dielectric materials continue to displace ceramic materials because of cost, reduced weight, and performance advantages. Because thermosetting dielectric composites have long found widespread use in printed wiring board (PWB) fabrication, they have been the components of choice for many organic chip carriers. Conversely, thermoplastic dielectrics, such as fluoropolymer (FP), and in particular poly(tetrafluoroethylene)-based dielectric composites (PTFE composites) have seldom found use in multilayer wiring packages in spite of their attractive electrical properties due to their processing challenges. In this paper, we report the use of a model system comprising pure PTFE film and Cr-coated copper surfaces to optimize the bonding process through lamination conditions for a fluoropolymer composite and chromium-coated copper surfaces and to study both the interface mechanics and its chemistry as a function of processing parameters. The significant finding of the investigation was the linkage between the macroscopic mechanical properties of the interface and the observable chemical alteration of the same under some lamination conditions. The relationship of the interface properties and the processing conditions extend a conceptual framework for the thermodynamics of the metal-polymer interface and the reliability of these electronic packages in their practical designs.</description><subject>Applied sciences</subject><subject>Characterization and Evaluation of Materials</subject><subject>Chemistry and Materials Science</subject><subject>Chip carriers</subject><subject>Chromium</subject><subject>Circuit boards</subject><subject>Classical Mechanics</subject><subject>Composite materials</subject><subject>Composites</subject><subject>Copper</subject><subject>Crystallography and Scattering Methods</subject><subject>Dielectrics</subject><subject>Electrical properties</subject><subject>Electronic packaging</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Fluoropolymers</subject><subject>Forms of application and semi-finished materials</subject><subject>Interfacial properties</subject><subject>Materials Science</subject><subject>Mathematical models</subject><subject>Mechanical properties</subject><subject>Metal surfaces</subject><subject>Microelectronic fabrication (materials and surfaces technology)</subject><subject>Multilayers</subject><subject>Optimization</subject><subject>Organic chemistry</subject><subject>Polymer industry, paints, wood</subject><subject>Polymer matrix composites</subject><subject>Polymer Sciences</subject><subject>Polytetrafluoroethylene</subject><subject>Polytetrafluoroethylenes</subject><subject>Printed circuits</subject><subject>Process parameters</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>Solid Mechanics</subject><subject>Technology of polymers</subject><subject>Weight reduction</subject><issn>0022-2461</issn><issn>1573-4803</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2008</creationdate><recordtype>article</recordtype><sourceid>AFKRA</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><recordid>eNp9kUGL1jAQhoO44OeuP8BbQBQv1UnSpO1xWdZVWNDD3ss0nWiWtvnM9Dusv96ULi4IesqE95mXmXmFeK3ggwJoPrKC1pqqlJWutavaZ-KgbGOqugXzXBwAtC6KUy_ES-Z7ALCNVgcRL-WcRpokP_BKswwpy_UHyXRc4xx_4RrTIlOQE85x2X9HzDjTSpk34dvdp-tqQKZRjpEm8muOniUuoywQFuNTDuiJL8RZwInp1eN7Lkrn3dXn6vbrzZery9vK1wrWStVWO4tuGIOhFpouONV4G_zgghvAGqDR1WYIXil0de09BoDW-Va1wbXmXLzbbY85_TwRr_0c2dM04ULpxL3RYJ0FVcD3_wXLQbXqXAemoG_-Qu_TKS9li15r2zmnQHeFUjvlc2LOFPpjjjPmh2LVbyH1e0j9Vm4h9du0bx-dkT1OIePiI_9p1FDOYWtbOL1zXKTlO-WnCf5t_htSAKDQ</recordid><startdate>20080301</startdate><enddate>20080301</enddate><creator>Matienzo, Luis J.</creator><creator>Farquhar, Donald</creator><general>Springer US</general><general>Springer</general><general>Springer Nature B.V</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>8FE</scope><scope>8FG</scope><scope>ABJCF</scope><scope>AFKRA</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>HCIFZ</scope><scope>KB.</scope><scope>L6V</scope><scope>M7S</scope><scope>PDBOC</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>PTHSS</scope><scope>7QQ</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>20080301</creationdate><title>A model system for the optimization of lamination parameters of PTFE-based dielectrics and metal surfaces</title><author>Matienzo, Luis J. ; Farquhar, Donald</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c410t-145265a6bdf3e8079f617c5fcb6f6b0530ed643bfc11a644ccaf0086c818f683</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2008</creationdate><topic>Applied sciences</topic><topic>Characterization and Evaluation of Materials</topic><topic>Chemistry and Materials Science</topic><topic>Chip carriers</topic><topic>Chromium</topic><topic>Circuit boards</topic><topic>Classical Mechanics</topic><topic>Composite materials</topic><topic>Composites</topic><topic>Copper</topic><topic>Crystallography and Scattering Methods</topic><topic>Dielectrics</topic><topic>Electrical properties</topic><topic>Electronic packaging</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Fluoropolymers</topic><topic>Forms of application and semi-finished materials</topic><topic>Interfacial properties</topic><topic>Materials Science</topic><topic>Mathematical models</topic><topic>Mechanical properties</topic><topic>Metal surfaces</topic><topic>Microelectronic fabrication (materials and surfaces technology)</topic><topic>Multilayers</topic><topic>Optimization</topic><topic>Organic chemistry</topic><topic>Polymer industry, paints, wood</topic><topic>Polymer matrix composites</topic><topic>Polymer Sciences</topic><topic>Polytetrafluoroethylene</topic><topic>Polytetrafluoroethylenes</topic><topic>Printed circuits</topic><topic>Process parameters</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>Solid Mechanics</topic><topic>Technology of polymers</topic><topic>Weight reduction</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Matienzo, Luis J.</creatorcontrib><creatorcontrib>Farquhar, Donald</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central UK/Ireland</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>SciTech Premium Collection</collection><collection>Materials Science Database</collection><collection>ProQuest Engineering Collection</collection><collection>Engineering Database</collection><collection>Materials Science Collection</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><collection>Engineering Collection</collection><collection>Ceramic Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Journal of materials science</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Matienzo, Luis J.</au><au>Farquhar, Donald</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>A model system for the optimization of lamination parameters of PTFE-based dielectrics and metal surfaces</atitle><jtitle>Journal of materials science</jtitle><stitle>J Mater Sci</stitle><date>2008-03-01</date><risdate>2008</risdate><volume>43</volume><issue>6</issue><spage>2035</spage><epage>2045</epage><pages>2035-2045</pages><issn>0022-2461</issn><eissn>1573-4803</eissn><coden>JMTSAS</coden><abstract>In microelectronic packaging, organic dielectric materials continue to displace ceramic materials because of cost, reduced weight, and performance advantages. Because thermosetting dielectric composites have long found widespread use in printed wiring board (PWB) fabrication, they have been the components of choice for many organic chip carriers. Conversely, thermoplastic dielectrics, such as fluoropolymer (FP), and in particular poly(tetrafluoroethylene)-based dielectric composites (PTFE composites) have seldom found use in multilayer wiring packages in spite of their attractive electrical properties due to their processing challenges. In this paper, we report the use of a model system comprising pure PTFE film and Cr-coated copper surfaces to optimize the bonding process through lamination conditions for a fluoropolymer composite and chromium-coated copper surfaces and to study both the interface mechanics and its chemistry as a function of processing parameters. The significant finding of the investigation was the linkage between the macroscopic mechanical properties of the interface and the observable chemical alteration of the same under some lamination conditions. The relationship of the interface properties and the processing conditions extend a conceptual framework for the thermodynamics of the metal-polymer interface and the reliability of these electronic packages in their practical designs.</abstract><cop>New York</cop><pub>Springer US</pub><doi>10.1007/s10853-007-2426-8</doi><tpages>11</tpages></addata></record> |
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| subjects | Applied sciences Characterization and Evaluation of Materials Chemistry and Materials Science Chip carriers Chromium Circuit boards Classical Mechanics Composite materials Composites Copper Crystallography and Scattering Methods Dielectrics Electrical properties Electronic packaging Electronics Exact sciences and technology Fluoropolymers Forms of application and semi-finished materials Interfacial properties Materials Science Mathematical models Mechanical properties Metal surfaces Microelectronic fabrication (materials and surfaces technology) Multilayers Optimization Organic chemistry Polymer industry, paints, wood Polymer matrix composites Polymer Sciences Polytetrafluoroethylene Polytetrafluoroethylenes Printed circuits Process parameters Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Solid Mechanics Technology of polymers Weight reduction |
| title | A model system for the optimization of lamination parameters of PTFE-based dielectrics and metal surfaces |
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