Electromagnetic optimization of an RF-MEMS wafer-level package

In this work, we present electromagnetic optimization of a wafer-level package (WLP) intended for RF-MEMS applications. The packaging solution presented is based on a high-resistivity silicon capping substrate containing recesses and copper-filled thru-hole vias. This pre-fabricated capping substrat...

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Veröffentlicht in:	Sensors and actuators. A. Physical. 2008-03, Vol.142 (1), p.434-441
Hauptverfasser:	Iannacci, J., Bartek, M., Tian, J., Gaddi, R., Gnudi, A.
Format:	Artikel
Sprache:	eng
Schlagworte:	Ansoft HFSS Electromagnetic optimization RF-MEMS Wafer-level package (WLP)
Online-Zugang:	Volltext
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