The Application of Motif Characterizing Method in the Surface Topography Evaluation of MEMS Device

The Application of Motif Characterizing Method in the Surface Topography Evaluation of MEMS Device

The surface topography characterization of MEMS device is very important to bonding technology of MEMS device. Motif characterizing method is a characterizing method of surface topography by graph. Aiming at the diversity and regionality of surface topography of MEMS device, in this study we have sa...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Key engineering materials 2008-01, Vol.364-366, p.210-214
Hauptverfasser: Wang, Shenghuai, Xie, Tiebang, Yang, Xudong
Format: Artikel
Sprache:eng
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page 214
container_issue
container_start_page 210
container_title Key engineering materials
container_volume 364-366
creator Wang, Shenghuai
Xie, Tiebang
Yang, Xudong
description The surface topography characterization of MEMS device is very important to bonding technology of MEMS device. Motif characterizing method is a characterizing method of surface topography by graph. Aiming at the diversity and regionality of surface topography of MEMS device, in this study we have sampled the surface of MEMS device by 3-dimentinal grids using the surface profiler developed by us and characterizes the surface topography of MEMS device by the extended Motif characterizing method. The surface of MEMS device is divided into several Motif regions; the surface topography of every divided region can be evaluated respectively; the details of every region can be zoomed and these regions as a whole or every region can be revolved and projected; one of these regions can be as the reference of other regions. So the height, gradient and other characteristics of others regions of the whole MEMS device surface can be analyzed relative to the reference region; the whole and local surface topography of whole MEMS device can be analyzed.
format Article
fullrecord <record><control><sourceid>proquest</sourceid><recordid>TN_cdi_proquest_miscellaneous_31909926</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>31909926</sourcerecordid><originalsourceid>FETCH-LOGICAL-p101t-1c047f760176a4c0431b9690c473e0e92890a46bcd913dc9ea2ad3d65e0e770f3</originalsourceid><addsrcrecordid>eNpFjk1LxDAURbNQcBz9D1m5KyRNJ2mWQ60fMIOLqevhNX2ZRmoTm3RAf70FhVldLpdzuFdkxRkXmS5zeUNuY_xgTPCSb1akbXqk2xAGZyA5P1Jv6d4nZ2nVwwQm4eR-3Hiie0y976gbaVqIwzxZMEgbH_xpgtB_0_oMw3xx1PsDfcSzM3hHri0MEe__c03en-qmesl2b8-v1XaXheVcyrhhhbJKMq4kFEsRvNVSM1MogQx1XmoGhWxNp7nojEbIoROd3CyjUsyKNXn484bJf80Y0_HTRYPDACP6OR4F10zrXIpfBYZRQQ</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>31909926</pqid></control><display><type>article</type><title>The Application of Motif Characterizing Method in the Surface Topography Evaluation of MEMS Device</title><source>Scientific.net Journals</source><creator>Wang, Shenghuai ; Xie, Tiebang ; Yang, Xudong</creator><creatorcontrib>Wang, Shenghuai ; Xie, Tiebang ; Yang, Xudong</creatorcontrib><description>The surface topography characterization of MEMS device is very important to bonding technology of MEMS device. Motif characterizing method is a characterizing method of surface topography by graph. Aiming at the diversity and regionality of surface topography of MEMS device, in this study we have sampled the surface of MEMS device by 3-dimentinal grids using the surface profiler developed by us and characterizes the surface topography of MEMS device by the extended Motif characterizing method. The surface of MEMS device is divided into several Motif regions; the surface topography of every divided region can be evaluated respectively; the details of every region can be zoomed and these regions as a whole or every region can be revolved and projected; one of these regions can be as the reference of other regions. So the height, gradient and other characteristics of others regions of the whole MEMS device surface can be analyzed relative to the reference region; the whole and local surface topography of whole MEMS device can be analyzed.</description><identifier>ISSN: 1013-9826</identifier><language>eng</language><ispartof>Key engineering materials, 2008-01, Vol.364-366, p.210-214</ispartof><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784</link.rule.ids></links><search><creatorcontrib>Wang, Shenghuai</creatorcontrib><creatorcontrib>Xie, Tiebang</creatorcontrib><creatorcontrib>Yang, Xudong</creatorcontrib><title>The Application of Motif Characterizing Method in the Surface Topography Evaluation of MEMS Device</title><title>Key engineering materials</title><description>The surface topography characterization of MEMS device is very important to bonding technology of MEMS device. Motif characterizing method is a characterizing method of surface topography by graph. Aiming at the diversity and regionality of surface topography of MEMS device, in this study we have sampled the surface of MEMS device by 3-dimentinal grids using the surface profiler developed by us and characterizes the surface topography of MEMS device by the extended Motif characterizing method. The surface of MEMS device is divided into several Motif regions; the surface topography of every divided region can be evaluated respectively; the details of every region can be zoomed and these regions as a whole or every region can be revolved and projected; one of these regions can be as the reference of other regions. So the height, gradient and other characteristics of others regions of the whole MEMS device surface can be analyzed relative to the reference region; the whole and local surface topography of whole MEMS device can be analyzed.</description><issn>1013-9826</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2008</creationdate><recordtype>article</recordtype><recordid>eNpFjk1LxDAURbNQcBz9D1m5KyRNJ2mWQ60fMIOLqevhNX2ZRmoTm3RAf70FhVldLpdzuFdkxRkXmS5zeUNuY_xgTPCSb1akbXqk2xAGZyA5P1Jv6d4nZ2nVwwQm4eR-3Hiie0y976gbaVqIwzxZMEgbH_xpgtB_0_oMw3xx1PsDfcSzM3hHri0MEe__c03en-qmesl2b8-v1XaXheVcyrhhhbJKMq4kFEsRvNVSM1MogQx1XmoGhWxNp7nojEbIoROd3CyjUsyKNXn484bJf80Y0_HTRYPDACP6OR4F10zrXIpfBYZRQQ</recordid><startdate>20080101</startdate><enddate>20080101</enddate><creator>Wang, Shenghuai</creator><creator>Xie, Tiebang</creator><creator>Yang, Xudong</creator><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>20080101</creationdate><title>The Application of Motif Characterizing Method in the Surface Topography Evaluation of MEMS Device</title><author>Wang, Shenghuai ; Xie, Tiebang ; Yang, Xudong</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-p101t-1c047f760176a4c0431b9690c473e0e92890a46bcd913dc9ea2ad3d65e0e770f3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2008</creationdate><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Wang, Shenghuai</creatorcontrib><creatorcontrib>Xie, Tiebang</creatorcontrib><creatorcontrib>Yang, Xudong</creatorcontrib><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Key engineering materials</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Wang, Shenghuai</au><au>Xie, Tiebang</au><au>Yang, Xudong</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>The Application of Motif Characterizing Method in the Surface Topography Evaluation of MEMS Device</atitle><jtitle>Key engineering materials</jtitle><date>2008-01-01</date><risdate>2008</risdate><volume>364-366</volume><spage>210</spage><epage>214</epage><pages>210-214</pages><issn>1013-9826</issn><abstract>The surface topography characterization of MEMS device is very important to bonding technology of MEMS device. Motif characterizing method is a characterizing method of surface topography by graph. Aiming at the diversity and regionality of surface topography of MEMS device, in this study we have sampled the surface of MEMS device by 3-dimentinal grids using the surface profiler developed by us and characterizes the surface topography of MEMS device by the extended Motif characterizing method. The surface of MEMS device is divided into several Motif regions; the surface topography of every divided region can be evaluated respectively; the details of every region can be zoomed and these regions as a whole or every region can be revolved and projected; one of these regions can be as the reference of other regions. So the height, gradient and other characteristics of others regions of the whole MEMS device surface can be analyzed relative to the reference region; the whole and local surface topography of whole MEMS device can be analyzed.</abstract><tpages>5</tpages></addata></record>
fulltext fulltext
identifier ISSN: 1013-9826
ispartof Key engineering materials, 2008-01, Vol.364-366, p.210-214
issn 1013-9826
language eng
recordid cdi_proquest_miscellaneous_31909926
source Scientific.net Journals
title The Application of Motif Characterizing Method in the Surface Topography Evaluation of MEMS Device
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-14T08%3A46%3A12IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=The%20Application%20of%20Motif%20Characterizing%20Method%20in%20the%20Surface%20Topography%20Evaluation%20of%20MEMS%20Device&rft.jtitle=Key%20engineering%20materials&rft.au=Wang,%20Shenghuai&rft.date=2008-01-01&rft.volume=364-366&rft.spage=210&rft.epage=214&rft.pages=210-214&rft.issn=1013-9826&rft_id=info:doi/&rft_dat=%3Cproquest%3E31909926%3C/proquest%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=31909926&rft_id=info:pmid/&rfr_iscdi=true