Effects of a magnetic field on the copper metallization using the electroplating process

We investigated the effects of a magnetic field on the electroplated copper films for the ULSI processes. The magnetic field was induced vertical to the electrodes and varied ranging from 0 to 600 G. The electroplating process was performed with on–off square pulse current source. The variation of t...

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Veröffentlicht in:	Microelectronic engineering 2008-02, Vol.85 (2), p.308-314
Hauptverfasser:	Park, Byung-Nam, Sohn, Young-Soo, Choi, Sie-Young
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Cu metallization Design. Technologies. Operation analysis. Testing Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Electroplating Exact sciences and technology Integrated circuits Magnetic field Microelectronic fabrication (materials and surfaces technology) Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
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