The Performance and Optimization of Slurry on the Double Sided Polishing Process of Silicon Wafer
This study compares the effectiveness of different polishing slurries for Double Sided Polishing process of Silicon wafer in the polished surface roughness and stock removal rate, discusses the mechanism of Double Sided Polishing for silicon wafer with different type slurries, also the influence of...
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| Veröffentlicht in: | Key engineering materials 2008-01, Vol.359-360, p.324-328 |
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| container_end_page | 328 |
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| container_start_page | 324 |
| container_title | Key engineering materials |
| container_volume | 359-360 |
| creator | Hu, Xiao Zhen Li, Wei Hu, Gang Xiang Hu, Xiao Dong |
| description | This study compares the effectiveness of different polishing slurries for Double Sided
Polishing process of Silicon wafer in the polished surface roughness and stock removal rate,
discusses the mechanism of Double Sided Polishing for silicon wafer with different type slurries,
also the influence of the pH value, temperature and concentration of the slurries are discussed in
this paper. Furthermore, by the optimization of the process parameters, the ultra-smooth of polished
surface of silicon wafer has been got with higher efficient. |
| doi_str_mv | 10.4028/www.scientific.net/KEM.359-360.324 |
| format | Article |
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Polishing process of Silicon wafer in the polished surface roughness and stock removal rate,
discusses the mechanism of Double Sided Polishing for silicon wafer with different type slurries,
also the influence of the pH value, temperature and concentration of the slurries are discussed in
this paper. Furthermore, by the optimization of the process parameters, the ultra-smooth of polished
surface of silicon wafer has been got with higher efficient.</description><identifier>ISSN: 1013-9826</identifier><identifier>ISSN: 1662-9795</identifier><identifier>EISSN: 1662-9795</identifier><identifier>DOI: 10.4028/www.scientific.net/KEM.359-360.324</identifier><language>eng</language><publisher>Trans Tech Publications Ltd</publisher><ispartof>Key engineering materials, 2008-01, Vol.359-360, p.324-328</ispartof><rights>2008 Trans Tech Publications Ltd</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><cites>FETCH-LOGICAL-c306t-67a2a341d32ae4e54f98990dd8f7cfffc3ee06948a41e3e70e3df6b42604ee053</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Uhttps://www.scientific.net/Image/TitleCover/87?width=600</thumbnail><link.rule.ids>314,776,780,27901,27902</link.rule.ids></links><search><creatorcontrib>Hu, Xiao Zhen</creatorcontrib><creatorcontrib>Li, Wei</creatorcontrib><creatorcontrib>Hu, Gang Xiang</creatorcontrib><creatorcontrib>Hu, Xiao Dong</creatorcontrib><title>The Performance and Optimization of Slurry on the Double Sided Polishing Process of Silicon Wafer</title><title>Key engineering materials</title><description>This study compares the effectiveness of different polishing slurries for Double Sided
Polishing process of Silicon wafer in the polished surface roughness and stock removal rate,
discusses the mechanism of Double Sided Polishing for silicon wafer with different type slurries,
also the influence of the pH value, temperature and concentration of the slurries are discussed in
this paper. Furthermore, by the optimization of the process parameters, the ultra-smooth of polished
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Polishing process of Silicon wafer in the polished surface roughness and stock removal rate,
discusses the mechanism of Double Sided Polishing for silicon wafer with different type slurries,
also the influence of the pH value, temperature and concentration of the slurries are discussed in
this paper. Furthermore, by the optimization of the process parameters, the ultra-smooth of polished
surface of silicon wafer has been got with higher efficient.</abstract><pub>Trans Tech Publications Ltd</pub><doi>10.4028/www.scientific.net/KEM.359-360.324</doi><tpages>5</tpages></addata></record> |
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| title | The Performance and Optimization of Slurry on the Double Sided Polishing Process of Silicon Wafer |
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