Harmless process of organic matter in organosilicon waste residue by fluidization-like DDBD reactor: Temperature action and mechanism

Herein, the non-hazardous application of low-temperature plasma technology in solid waste from the silicone industry was investigated by using a fluidization-like double dielectric barrier discharge plasma (DDBD) reactor. The results show ∼92.9% TOC in the organosilicon waste residue could be remove...

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Veröffentlicht in:	Chemosphere (Oxford) 2023-05, Vol.322, p.138116-138116, Article 138116
Hauptverfasser:	Wang, Guanjie, Ye, Zhiping, Dong, Shuhan, Wang, Jiade
Format:	Artikel
Sprache:	eng
Schlagworte:	carbon dioxide Cold Temperature Degradation mechanism Double dielectric barrier discharge energy efficiency Gas Chromatography-Mass Spectrometry heat industry Non-thermal plasma organic matter Organosilicon waste residue silicone Solid waste solid wastes Temperature
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