Reliability-driven layout decompaction for electromigration failure avoidance in complex mixed-signal IC designs

The negative effect of electromigration on signal and power line lifetime and functional reliability is an increasingly important problem for the physical design of integrated circuits. We present a new approach that addresses this electromigration issue by considering current density and inhomogene...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Jerke, Göran, Lienig, Jens, Scheible, Jürgen
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Algorithm design and analysis Applied sciences Automotive electronics Conducting materials Current density Design. Technologies. Operation analysis. Testing Electromigration Electronics Exact sciences and technology Hardware > Electronic design automation > Physical design (EDA) Integrated circuit interconnections Integrated circuit layout Integrated circuit reliability Integrated circuits Microelectronic fabrication (materials and surfaces technology) Routing Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Signal design
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!