Investigation of Dissolution Behavior of Metallic Substrates and Intermetallic Compound in Molten Lead-free Solders
This study investigates the dissolution behavior of the metallic substrates Cu and Ag and the intermetallic compound (IMC)-Ag 3 Sn in molten Sn, Sn-3.0Ag-0.5Cu, Sn-58Bi and Sn-9Zn (in wt.%) at 300, 270 and 240°C. The dissolution rates of both Cu and Ag in molten solder follow the order Sn > Sn-3....
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| Veröffentlicht in: | Journal of electronic materials 2008-01, Vol.37 (1), p.73-83 |
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| creator | Yen, Yee-Wen Chou, Weng-Ting Tseng, Yu Lee, Chiapyng Hsu, Chun-Lei |
| description | This study investigates the dissolution behavior of the metallic substrates Cu and Ag and the intermetallic compound (IMC)-Ag
3
Sn in molten Sn, Sn-3.0Ag-0.5Cu, Sn-58Bi and Sn-9Zn (in wt.%) at 300, 270 and 240°C. The dissolution rates of both Cu and Ag in molten solder follow the order Sn > Sn-3.0Ag-0.5Cu >Sn-58Bi > Sn-9Zn. Planar Cu
3
Sn and scalloped Cu
6
Sn
5
phases in Cu/solders and the scalloped Ag
3
Sn phase in Ag/solders are observed at the metallic substrate/solder interface. The dissolution mechanism is controlled by grain boundary diffusion. The planar Cu
5
Zn
8
layer formed in the Sn-9Zn/Cu systems. AgZn
3
, Ag5Zn
8
and AgZn phases are found in the Sn-9Zn/Ag system and the dissolution mechanism is controlled by lattice diffusion. Massive Ag
3
Sn phases dissolved into the solders and formed during solidification processes in the Ag
3
Sn/Sn or Sn-3.0Ag-0.5Cu systems. AgZn
3
and Ag
5
Zn
8
phases are formed at the Sn-9Zn/Ag
3
Sn interface. Zn atoms diffuse through Ag-Zn IMCs to form (Ag, Zn)Sn
4
and Sn-rich regions between Ag
5
Zn
8
and Ag
3
Sn. |
| doi_str_mv | 10.1007/s11664-007-0266-6 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_31402309</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>1415016701</sourcerecordid><originalsourceid>FETCH-LOGICAL-c442t-8b955f6babdbab2a7013f2ac58d1e3805be2011e928eb7d4993a0a5bc017cda73</originalsourceid><addsrcrecordid>eNp1kU2LFDEQhhtRcFz9Ad4aQW_RVL66-6jj18AsHlbBW6hOV69ZMsmYdC_47804q4LgIaRS9dTLG96meQr8JXDevSoAxihWS8aFMczcazaglWTQm6_3mw2XBpgWUj9sHpVywzlo6GHTlF28pbL4a1x8im2a27e-lBTWX8839A1vfcqn_iUtGIJ37dU6liXjQqXFOLW7uFA-_B5u0-GY1tr2sb1MYaHY7gknNmei9iqFiXJ53DyYMRR6cndfNF_ev_u8_cj2nz7stq_3zCklFtaPg9azGXGc6hHYcZCzQKf7CUj2XI8kOAANoqexm9QwSOSoR8ehcxN28qJ5cdY95vR9rb-0B18chYCR0lqsBMWF5EMFn_0D3qQ1x-rNCq56pUwvKgRnyOVUSqbZHrM_YP5hgdtTBvacgT2VpwysqTvP74SxOAxzxuh8-bNY7XegtK6cOHOljuI15b8G_i_-E2Fdl_0</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>204844682</pqid></control><display><type>article</type><title>Investigation of Dissolution Behavior of Metallic Substrates and Intermetallic Compound in Molten Lead-free Solders</title><source>SpringerNature Journals</source><creator>Yen, Yee-Wen ; Chou, Weng-Ting ; Tseng, Yu ; Lee, Chiapyng ; Hsu, Chun-Lei</creator><creatorcontrib>Yen, Yee-Wen ; Chou, Weng-Ting ; Tseng, Yu ; Lee, Chiapyng ; Hsu, Chun-Lei</creatorcontrib><description>This study investigates the dissolution behavior of the metallic substrates Cu and Ag and the intermetallic compound (IMC)-Ag
3
Sn in molten Sn, Sn-3.0Ag-0.5Cu, Sn-58Bi and Sn-9Zn (in wt.%) at 300, 270 and 240°C. The dissolution rates of both Cu and Ag in molten solder follow the order Sn > Sn-3.0Ag-0.5Cu >Sn-58Bi > Sn-9Zn. Planar Cu
3
Sn and scalloped Cu
6
Sn
5
phases in Cu/solders and the scalloped Ag
3
Sn phase in Ag/solders are observed at the metallic substrate/solder interface. The dissolution mechanism is controlled by grain boundary diffusion. The planar Cu
5
Zn
8
layer formed in the Sn-9Zn/Cu systems. AgZn
3
, Ag5Zn
8
and AgZn phases are found in the Sn-9Zn/Ag system and the dissolution mechanism is controlled by lattice diffusion. Massive Ag
3
Sn phases dissolved into the solders and formed during solidification processes in the Ag
3
Sn/Sn or Sn-3.0Ag-0.5Cu systems. AgZn
3
and Ag
5
Zn
8
phases are formed at the Sn-9Zn/Ag
3
Sn interface. Zn atoms diffuse through Ag-Zn IMCs to form (Ag, Zn)Sn
4
and Sn-rich regions between Ag
5
Zn
8
and Ag
3
Sn.</description><identifier>ISSN: 0361-5235</identifier><identifier>EISSN: 1543-186X</identifier><identifier>DOI: 10.1007/s11664-007-0266-6</identifier><identifier>CODEN: JECMA5</identifier><language>eng</language><publisher>Boston: Springer US</publisher><subject>Alloys ; Applied sciences ; Brazing. Soldering ; Characterization and Evaluation of Materials ; Chemistry and Materials Science ; Condensed matter: structure, mechanical and thermal properties ; Cross-disciplinary physics: materials science; rheology ; Diffusion ; Dissolution ; Electronics ; Electronics and Microelectronics ; Equations of state, phase equilibria, and phase transitions ; Exact sciences and technology ; Instrumentation ; Intermetallic compounds ; Joining, thermal cutting: metallurgical aspects ; Lead free solders ; Materials ; Materials Science ; Metals. Metallurgy ; Optical and Electronic Materials ; Phase diagrams and microstructures developed by solidification and solid-solid phase transformations ; Physics ; Solid State Physics ; Solidification ; Solubility, segregation, and mixing; phase separation ; Substrates</subject><ispartof>Journal of electronic materials, 2008-01, Vol.37 (1), p.73-83</ispartof><rights>TMS 2007</rights><rights>2008 INIST-CNRS</rights><rights>Copyright Minerals, Metals & Materials Society Jan 2008</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c442t-8b955f6babdbab2a7013f2ac58d1e3805be2011e928eb7d4993a0a5bc017cda73</citedby><cites>FETCH-LOGICAL-c442t-8b955f6babdbab2a7013f2ac58d1e3805be2011e928eb7d4993a0a5bc017cda73</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s11664-007-0266-6$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s11664-007-0266-6$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>309,310,314,780,784,789,790,23930,23931,25140,27924,27925,41488,42557,51319</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=20171455$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Yen, Yee-Wen</creatorcontrib><creatorcontrib>Chou, Weng-Ting</creatorcontrib><creatorcontrib>Tseng, Yu</creatorcontrib><creatorcontrib>Lee, Chiapyng</creatorcontrib><creatorcontrib>Hsu, Chun-Lei</creatorcontrib><title>Investigation of Dissolution Behavior of Metallic Substrates and Intermetallic Compound in Molten Lead-free Solders</title><title>Journal of electronic materials</title><addtitle>Journal of Elec Materi</addtitle><description>This study investigates the dissolution behavior of the metallic substrates Cu and Ag and the intermetallic compound (IMC)-Ag
3
Sn in molten Sn, Sn-3.0Ag-0.5Cu, Sn-58Bi and Sn-9Zn (in wt.%) at 300, 270 and 240°C. The dissolution rates of both Cu and Ag in molten solder follow the order Sn > Sn-3.0Ag-0.5Cu >Sn-58Bi > Sn-9Zn. Planar Cu
3
Sn and scalloped Cu
6
Sn
5
phases in Cu/solders and the scalloped Ag
3
Sn phase in Ag/solders are observed at the metallic substrate/solder interface. The dissolution mechanism is controlled by grain boundary diffusion. The planar Cu
5
Zn
8
layer formed in the Sn-9Zn/Cu systems. AgZn
3
, Ag5Zn
8
and AgZn phases are found in the Sn-9Zn/Ag system and the dissolution mechanism is controlled by lattice diffusion. Massive Ag
3
Sn phases dissolved into the solders and formed during solidification processes in the Ag
3
Sn/Sn or Sn-3.0Ag-0.5Cu systems. AgZn
3
and Ag
5
Zn
8
phases are formed at the Sn-9Zn/Ag
3
Sn interface. Zn atoms diffuse through Ag-Zn IMCs to form (Ag, Zn)Sn
4
and Sn-rich regions between Ag
5
Zn
8
and Ag
3
Sn.</description><subject>Alloys</subject><subject>Applied sciences</subject><subject>Brazing. Soldering</subject><subject>Characterization and Evaluation of Materials</subject><subject>Chemistry and Materials Science</subject><subject>Condensed matter: structure, mechanical and thermal properties</subject><subject>Cross-disciplinary physics: materials science; rheology</subject><subject>Diffusion</subject><subject>Dissolution</subject><subject>Electronics</subject><subject>Electronics and Microelectronics</subject><subject>Equations of state, phase equilibria, and phase transitions</subject><subject>Exact sciences and technology</subject><subject>Instrumentation</subject><subject>Intermetallic compounds</subject><subject>Joining, thermal cutting: metallurgical aspects</subject><subject>Lead free solders</subject><subject>Materials</subject><subject>Materials Science</subject><subject>Metals. Metallurgy</subject><subject>Optical and Electronic Materials</subject><subject>Phase diagrams and microstructures developed by solidification and solid-solid phase transformations</subject><subject>Physics</subject><subject>Solid State Physics</subject><subject>Solidification</subject><subject>Solubility, segregation, and mixing; phase separation</subject><subject>Substrates</subject><issn>0361-5235</issn><issn>1543-186X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2008</creationdate><recordtype>article</recordtype><sourceid>8G5</sourceid><sourceid>ABUWG</sourceid><sourceid>AFKRA</sourceid><sourceid>AZQEC</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><sourceid>GNUQQ</sourceid><sourceid>GUQSH</sourceid><sourceid>M2O</sourceid><recordid>eNp1kU2LFDEQhhtRcFz9Ad4aQW_RVL66-6jj18AsHlbBW6hOV69ZMsmYdC_47804q4LgIaRS9dTLG96meQr8JXDevSoAxihWS8aFMczcazaglWTQm6_3mw2XBpgWUj9sHpVywzlo6GHTlF28pbL4a1x8im2a27e-lBTWX8839A1vfcqn_iUtGIJ37dU6liXjQqXFOLW7uFA-_B5u0-GY1tr2sb1MYaHY7gknNmei9iqFiXJ53DyYMRR6cndfNF_ev_u8_cj2nz7stq_3zCklFtaPg9azGXGc6hHYcZCzQKf7CUj2XI8kOAANoqexm9QwSOSoR8ehcxN28qJ5cdY95vR9rb-0B18chYCR0lqsBMWF5EMFn_0D3qQ1x-rNCq56pUwvKgRnyOVUSqbZHrM_YP5hgdtTBvacgT2VpwysqTvP74SxOAxzxuh8-bNY7XegtK6cOHOljuI15b8G_i_-E2Fdl_0</recordid><startdate>20080101</startdate><enddate>20080101</enddate><creator>Yen, Yee-Wen</creator><creator>Chou, Weng-Ting</creator><creator>Tseng, Yu</creator><creator>Lee, Chiapyng</creator><creator>Hsu, Chun-Lei</creator><general>Springer US</general><general>Institute of Electrical and Electronics Engineers</general><general>Springer Nature B.V</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>3V.</scope><scope>7XB</scope><scope>88I</scope><scope>8AF</scope><scope>8AO</scope><scope>8FE</scope><scope>8FG</scope><scope>8FK</scope><scope>8G5</scope><scope>ABJCF</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>ARAPS</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>GNUQQ</scope><scope>GUQSH</scope><scope>HCIFZ</scope><scope>KB.</scope><scope>L6V</scope><scope>M2O</scope><scope>M2P</scope><scope>M7S</scope><scope>MBDVC</scope><scope>P5Z</scope><scope>P62</scope><scope>PDBOC</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PTHSS</scope><scope>Q9U</scope><scope>S0X</scope><scope>7QQ</scope><scope>7SP</scope><scope>7SR</scope><scope>7U5</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope><scope>L7M</scope></search><sort><creationdate>20080101</creationdate><title>Investigation of Dissolution Behavior of Metallic Substrates and Intermetallic Compound in Molten Lead-free Solders</title><author>Yen, Yee-Wen ; Chou, Weng-Ting ; Tseng, Yu ; Lee, Chiapyng ; Hsu, Chun-Lei</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c442t-8b955f6babdbab2a7013f2ac58d1e3805be2011e928eb7d4993a0a5bc017cda73</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2008</creationdate><topic>Alloys</topic><topic>Applied sciences</topic><topic>Brazing. Soldering</topic><topic>Characterization and Evaluation of Materials</topic><topic>Chemistry and Materials Science</topic><topic>Condensed matter: structure, mechanical and thermal properties</topic><topic>Cross-disciplinary physics: materials science; rheology</topic><topic>Diffusion</topic><topic>Dissolution</topic><topic>Electronics</topic><topic>Electronics and Microelectronics</topic><topic>Equations of state, phase equilibria, and phase transitions</topic><topic>Exact sciences and technology</topic><topic>Instrumentation</topic><topic>Intermetallic compounds</topic><topic>Joining, thermal cutting: metallurgical aspects</topic><topic>Lead free solders</topic><topic>Materials</topic><topic>Materials Science</topic><topic>Metals. Metallurgy</topic><topic>Optical and Electronic Materials</topic><topic>Phase diagrams and microstructures developed by solidification and solid-solid phase transformations</topic><topic>Physics</topic><topic>Solid State Physics</topic><topic>Solidification</topic><topic>Solubility, segregation, and mixing; phase separation</topic><topic>Substrates</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Yen, Yee-Wen</creatorcontrib><creatorcontrib>Chou, Weng-Ting</creatorcontrib><creatorcontrib>Tseng, Yu</creatorcontrib><creatorcontrib>Lee, Chiapyng</creatorcontrib><creatorcontrib>Hsu, Chun-Lei</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>ProQuest Central (Corporate)</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>Science Database (Alumni Edition)</collection><collection>STEM Database</collection><collection>ProQuest Pharma Collection</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>ProQuest Central (Alumni) (purchase pre-March 2016)</collection><collection>Research Library (Alumni Edition)</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central (Alumni Edition)</collection><collection>ProQuest Central UK/Ireland</collection><collection>Advanced Technologies & Aerospace Collection</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>ProQuest Central Student</collection><collection>Research Library Prep</collection><collection>SciTech Premium Collection</collection><collection>Materials Science Database</collection><collection>ProQuest Engineering Collection</collection><collection>Research Library</collection><collection>Science Database</collection><collection>Engineering Database</collection><collection>Research Library (Corporate)</collection><collection>Advanced Technologies & Aerospace Database</collection><collection>ProQuest Advanced Technologies & Aerospace Collection</collection><collection>Materials Science Collection</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>Engineering Collection</collection><collection>ProQuest Central Basic</collection><collection>SIRS Editorial</collection><collection>Ceramic Abstracts</collection><collection>Electronics & Communications Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Journal of electronic materials</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Yen, Yee-Wen</au><au>Chou, Weng-Ting</au><au>Tseng, Yu</au><au>Lee, Chiapyng</au><au>Hsu, Chun-Lei</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Investigation of Dissolution Behavior of Metallic Substrates and Intermetallic Compound in Molten Lead-free Solders</atitle><jtitle>Journal of electronic materials</jtitle><stitle>Journal of Elec Materi</stitle><date>2008-01-01</date><risdate>2008</risdate><volume>37</volume><issue>1</issue><spage>73</spage><epage>83</epage><pages>73-83</pages><issn>0361-5235</issn><eissn>1543-186X</eissn><coden>JECMA5</coden><abstract>This study investigates the dissolution behavior of the metallic substrates Cu and Ag and the intermetallic compound (IMC)-Ag
3
Sn in molten Sn, Sn-3.0Ag-0.5Cu, Sn-58Bi and Sn-9Zn (in wt.%) at 300, 270 and 240°C. The dissolution rates of both Cu and Ag in molten solder follow the order Sn > Sn-3.0Ag-0.5Cu >Sn-58Bi > Sn-9Zn. Planar Cu
3
Sn and scalloped Cu
6
Sn
5
phases in Cu/solders and the scalloped Ag
3
Sn phase in Ag/solders are observed at the metallic substrate/solder interface. The dissolution mechanism is controlled by grain boundary diffusion. The planar Cu
5
Zn
8
layer formed in the Sn-9Zn/Cu systems. AgZn
3
, Ag5Zn
8
and AgZn phases are found in the Sn-9Zn/Ag system and the dissolution mechanism is controlled by lattice diffusion. Massive Ag
3
Sn phases dissolved into the solders and formed during solidification processes in the Ag
3
Sn/Sn or Sn-3.0Ag-0.5Cu systems. AgZn
3
and Ag
5
Zn
8
phases are formed at the Sn-9Zn/Ag
3
Sn interface. Zn atoms diffuse through Ag-Zn IMCs to form (Ag, Zn)Sn
4
and Sn-rich regions between Ag
5
Zn
8
and Ag
3
Sn.</abstract><cop>Boston</cop><pub>Springer US</pub><doi>10.1007/s11664-007-0266-6</doi><tpages>11</tpages></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 0361-5235 |
| ispartof | Journal of electronic materials, 2008-01, Vol.37 (1), p.73-83 |
| issn | 0361-5235 1543-186X |
| language | eng |
| recordid | cdi_proquest_miscellaneous_31402309 |
| source | SpringerNature Journals |
| subjects | Alloys Applied sciences Brazing. Soldering Characterization and Evaluation of Materials Chemistry and Materials Science Condensed matter: structure, mechanical and thermal properties Cross-disciplinary physics: materials science rheology Diffusion Dissolution Electronics Electronics and Microelectronics Equations of state, phase equilibria, and phase transitions Exact sciences and technology Instrumentation Intermetallic compounds Joining, thermal cutting: metallurgical aspects Lead free solders Materials Materials Science Metals. Metallurgy Optical and Electronic Materials Phase diagrams and microstructures developed by solidification and solid-solid phase transformations Physics Solid State Physics Solidification Solubility, segregation, and mixing phase separation Substrates |
| title | Investigation of Dissolution Behavior of Metallic Substrates and Intermetallic Compound in Molten Lead-free Solders |
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