A Study on the Effect of Pd Layer Thickness on the Properties of Cu-Ag Intermetallic Compounds at the Bonding Interface

This paper conducted a high-temperature storage test (HTST) on bonded samples made of Pd100 (Pd-coated Cu wire with a Pd layer thickness of 100 nm) and Pd120, and studied the growth law of Cu-Ag intermetallic compounds and the inhibitory mechanism of Pd thickness on Cu-Ag intermetallic compounds. Th...

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Veröffentlicht in:	Materials 2024-09, Vol.17 (17), p.4335
Hauptverfasser:	Fan, Junling, Yuan, Donglin, Du, Juan, Hou, Tao, Wang, Furong, Cao, Jun, Yang, Xuemei, Zhang, Yuemin
Format:	Artikel
Sprache:	eng
Schlagworte:	Chemical bonds Copper Copper wire Corrosion resistance Diffusion layers Diffusion rate Diffusion welding High temperature Humidity Intermetallic compounds Kirkendall effect Microcracks Palladium Silver Solid solutions Thermal cycling Thickness Voids Wire
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