Effect of UV Curing on Electrical Properties of a UV-Curable co-Polyacrylate/Silica Nanocomposite as a Transparent Encapsulation Resin for Device Packaging

Electrical properties of UV‐curable co‐polyacrylate/silica nanocomposite resins prepared via sol‐gel process for device encapsulation were investigated. It was found that, by appropriate UV curing process and the formation of nanoscale silica particles finely dispersed in the resin matrix, the leaka...

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Veröffentlicht in:	Macromolecular chemistry and physics 2007-11, Vol.208 (22), p.2396-2402
Hauptverfasser:	Wang, Yu-Young, Hsieh, Tsung-Eong
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Composites dielectric properties Electronics Exact sciences and technology Forms of application and semi-finished materials Materials microstructure nanocomposites photopolymerization Polymer industry, paints, wood Technology of polymers
Online-Zugang:	Volltext
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