Edge‐Passivated Monolayer WSe2 Nanoribbon Transistors

The ongoing reduction in transistor sizes drives advancements in information technology. However, as transistors shrink to the nanometer scale, surface and edge states begin to constrain their performance. 2D semiconductors like transition metal dichalcogenides (TMDs) have dangling‐bond‐free surfaces, hence achieving minimal surface states. Nonetheless, edge state disorder still limits the performance of width‐scaled 2D transistors. This work demonstrates a facile edge passivation method to enhance the electrical properties of monolayer WSe2 nanoribbons, by combining scanning transmission electron microscopy, optical spectroscopy, and field‐effect transistor (FET) transport measurements. Monolayer WSe2 nanoribbons are passivated with amorphous WOxSey at the edges, which is achieved using nanolithography and a controlled remote O2 plasma process. The same nanoribbons, with and without edge passivation are sequentially fabricated and measured. The passivated‐edge nanoribbon FETs exhibit 10 ± 6 times higher field‐effect mobility than the open‐edge nanoribbon FETs, which are characterized with dangling bonds at the edges. WOxSey edge passivation minimizes edge disorder and enhances the material quality of WSe2 nanoribbons. Owing to its simplicity and effectiveness, oxidation‐based edge passivation could become a turnkey manufacturing solution for TMD nanoribbons in beyond‐silicon electronics and optoelectronics. This study presents edge passivation for p‐type monolayer WSe2 nanoribbon transistors using nanolithography and a controlled remote O2 plasma process. The edge passivation material consists of amorphous WOxSey. Compared to microribbons, nanoribbons with passivated edges exhibit reduced defect density and increased p‐doping, whereas nanoribbons with open edges exhibit higher defect densities and reduced p‐doping.