The effect of anisotropy on the deformation and fracture of sapphire wafers subjected to thermal shocks

This paper studies the effect of anisotropy on the response of an R-plane sapphire wafer to a rapid thermal loading. The finite element method was used to analyse the temperature and stress distribution in the wafer when the environment was heated from room temperature to 800 °C, and then cooled dow...

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Veröffentlicht in:	Journal of materials processing technology 2007-11, Vol.194 (1), p.52-62
Hauptverfasser:	Vodenitcharova, T., Zhang, L.C., Zarudi, I., Yin, Y., Domyo, H., Ho, T., Sato, M.
Format:	Artikel
Sprache:	eng
Schlagworte:	Anisotropy Sapphire wafers Thermal shock Thermal stresses
Online-Zugang:	Volltext
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