An X-Ray Topographic Analysis of the Crystal Quality of Globally Available SiC Wafers

We present herein a first comparative analysis of the quality of 50 mm and 75 mm diameter SiC wafers, purchased directly from vendors across the world, types including the most widely available configurations. Large Area White Beam Synchrotron Back Reflection X-Ray Topography was used to analyse sel...

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Veröffentlicht in:	Materials science forum 2007-01, Vol.556-557, p.227-230
Hauptverfasser:	Simon, R., Lankinen, A., O'Reilly, L., McNally, Patrick J., Ren, N., Rowland, L.B., Tuomi, T.O., Brazil, I., Danilewsky, A., Soloviev, Stanislav I., Säynätjaki, A., Sandvik, Peter M.
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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