Mechanical properties of flexible microcomponents with a mobile load

This paper describes studies of the mechanical properties of flexible microcomponents: microbridges and microcantilevers. The stiffness and the bending stress, Young's modulus and the strain for different positions of the load are analyzed for samples manufactured from gold. A mathematical mode...

Ausführliche Beschreibung

Bibliographische Detailangaben

Veröffentlicht in:	Journal of micromechanics and microengineering 2007-08, Vol.17 (8), p.1611-1617
Hauptverfasser:	Pustan, M, Rymuza, Z
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Electronics Exact sciences and technology Instruments, apparatus, components and techniques common to several branches of physics and astronomy Mechanical engineering. Machine design Mechanical instruments, equipment and techniques Microelectronic fabrication (materials and surfaces technology) Micromechanical devices and systems Physics Precision engineering, watch making Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!