Interface Properties of Copper/Aluminum/Stainless Steel Clad Materials
Copper/aluminum/stainless steel (Cu/Al/STS) clad materials were made by rolling and heat treatment process. These specimens were evaluated the formability and bonding strength of Cu/Al/STS clad materials. Thin disc specimens for TEM observation were prepared from the interfaces of Cu/Al and Al/STS b...
Gespeichert in:
| Veröffentlicht in: | Key engineering materials 2007-08, Vol.345-346, p.1497-1500 |
|---|---|
| Hauptverfasser: | , , , , |
| Format: | Artikel |
| Sprache: | eng |
| Online-Zugang: | Volltext |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 1500 |
|---|---|
| container_issue | |
| container_start_page | 1497 |
| container_title | Key engineering materials |
| container_volume | 345-346 |
| creator | Bae, Dong Su Bae, Dong Hyun Kim, Soon Kook Shibayama, Tamaki Lee, Sang Ll |
| description | Copper/aluminum/stainless steel (Cu/Al/STS) clad materials were made by rolling and
heat treatment process. These specimens were evaluated the formability and bonding strength of
Cu/Al/STS clad materials. Thin disc specimens for TEM observation were prepared from the
interfaces of Cu/Al and Al/STS by using the Focused Ion Beam (FIB) utility. Brittle oxide film
formed on copper surface during heat treatment at 673K~773K. Diffusion bonding was observed at
the interface of Cu/Al. Reacted region was formed in the interface of Al/STS with width about
10nm, while in the case of Cu/Al was formed about 1,600nm width. It was also observed nanosized
crevice in reacted region of Al/STS interfaces. |
| doi_str_mv | 10.4028/www.scientific.net/KEM.345-346.1497 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_30009630</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>30009630</sourcerecordid><originalsourceid>FETCH-LOGICAL-c304t-87ff03a7d2194a37d4da4b7723e61ca77742b83f297360a321aa376433ab992e3</originalsourceid><addsrcrecordid>eNqVkE1LAzEQhoMoWD_-w568yO7mq8nmWJZWiy0K1XNId2cxZb9MshT_vSkVPHsYZgbeeWAehB4JzjimRX48HjNfWeiDbWyV9RDyl-U2Y3yeMi4ywpW8QDMiBE2VVPPLOGPCUlVQcY1uvD9gzEhB5jO0WvcBXGMqSN7cMIILFnwyNEk5jHHLF-3U2X7q8l0wtm_B-2QXANqkbE2dbE08tqb1d-iqiQ3uf_st-lgt38vndPP6tC4Xm7RimIe0kE2DmZE1JYobJmteG76XkjIQpDJSSk73BWuokkxgwygxMSU4Y2avFAV2ix7O3NENXxP4oDvrK2hb08Mwec0wxkowHIPlOVi5wXsHjR6d7Yz71gTrk0MdHeo_hzo61NGhjg5jCX1yGCnLMyU40_sA1ac-DJPr44v_4vwAAAeEvg</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>30009630</pqid></control><display><type>article</type><title>Interface Properties of Copper/Aluminum/Stainless Steel Clad Materials</title><source>Scientific.net Journals</source><creator>Bae, Dong Su ; Bae, Dong Hyun ; Kim, Soon Kook ; Shibayama, Tamaki ; Lee, Sang Ll</creator><creatorcontrib>Bae, Dong Su ; Bae, Dong Hyun ; Kim, Soon Kook ; Shibayama, Tamaki ; Lee, Sang Ll</creatorcontrib><description>Copper/aluminum/stainless steel (Cu/Al/STS) clad materials were made by rolling and
heat treatment process. These specimens were evaluated the formability and bonding strength of
Cu/Al/STS clad materials. Thin disc specimens for TEM observation were prepared from the
interfaces of Cu/Al and Al/STS by using the Focused Ion Beam (FIB) utility. Brittle oxide film
formed on copper surface during heat treatment at 673K~773K. Diffusion bonding was observed at
the interface of Cu/Al. Reacted region was formed in the interface of Al/STS with width about
10nm, while in the case of Cu/Al was formed about 1,600nm width. It was also observed nanosized
crevice in reacted region of Al/STS interfaces.</description><identifier>ISSN: 1013-9826</identifier><identifier>ISSN: 1662-9795</identifier><identifier>EISSN: 1662-9795</identifier><identifier>DOI: 10.4028/www.scientific.net/KEM.345-346.1497</identifier><language>eng</language><publisher>Trans Tech Publications Ltd</publisher><ispartof>Key engineering materials, 2007-08, Vol.345-346, p.1497-1500</ispartof><rights>2007 Trans Tech Publications Ltd</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c304t-87ff03a7d2194a37d4da4b7723e61ca77742b83f297360a321aa376433ab992e3</citedby><cites>FETCH-LOGICAL-c304t-87ff03a7d2194a37d4da4b7723e61ca77742b83f297360a321aa376433ab992e3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Uhttps://www.scientific.net/Image/TitleCover/70?width=600</thumbnail><link.rule.ids>314,780,784,27924,27925</link.rule.ids></links><search><creatorcontrib>Bae, Dong Su</creatorcontrib><creatorcontrib>Bae, Dong Hyun</creatorcontrib><creatorcontrib>Kim, Soon Kook</creatorcontrib><creatorcontrib>Shibayama, Tamaki</creatorcontrib><creatorcontrib>Lee, Sang Ll</creatorcontrib><title>Interface Properties of Copper/Aluminum/Stainless Steel Clad Materials</title><title>Key engineering materials</title><description>Copper/aluminum/stainless steel (Cu/Al/STS) clad materials were made by rolling and
heat treatment process. These specimens were evaluated the formability and bonding strength of
Cu/Al/STS clad materials. Thin disc specimens for TEM observation were prepared from the
interfaces of Cu/Al and Al/STS by using the Focused Ion Beam (FIB) utility. Brittle oxide film
formed on copper surface during heat treatment at 673K~773K. Diffusion bonding was observed at
the interface of Cu/Al. Reacted region was formed in the interface of Al/STS with width about
10nm, while in the case of Cu/Al was formed about 1,600nm width. It was also observed nanosized
crevice in reacted region of Al/STS interfaces.</description><issn>1013-9826</issn><issn>1662-9795</issn><issn>1662-9795</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2007</creationdate><recordtype>article</recordtype><recordid>eNqVkE1LAzEQhoMoWD_-w568yO7mq8nmWJZWiy0K1XNId2cxZb9MshT_vSkVPHsYZgbeeWAehB4JzjimRX48HjNfWeiDbWyV9RDyl-U2Y3yeMi4ywpW8QDMiBE2VVPPLOGPCUlVQcY1uvD9gzEhB5jO0WvcBXGMqSN7cMIILFnwyNEk5jHHLF-3U2X7q8l0wtm_B-2QXANqkbE2dbE08tqb1d-iqiQ3uf_st-lgt38vndPP6tC4Xm7RimIe0kE2DmZE1JYobJmteG76XkjIQpDJSSk73BWuokkxgwygxMSU4Y2avFAV2ix7O3NENXxP4oDvrK2hb08Mwec0wxkowHIPlOVi5wXsHjR6d7Yz71gTrk0MdHeo_hzo61NGhjg5jCX1yGCnLMyU40_sA1ac-DJPr44v_4vwAAAeEvg</recordid><startdate>20070815</startdate><enddate>20070815</enddate><creator>Bae, Dong Su</creator><creator>Bae, Dong Hyun</creator><creator>Kim, Soon Kook</creator><creator>Shibayama, Tamaki</creator><creator>Lee, Sang Ll</creator><general>Trans Tech Publications Ltd</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7QF</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>20070815</creationdate><title>Interface Properties of Copper/Aluminum/Stainless Steel Clad Materials</title><author>Bae, Dong Su ; Bae, Dong Hyun ; Kim, Soon Kook ; Shibayama, Tamaki ; Lee, Sang Ll</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c304t-87ff03a7d2194a37d4da4b7723e61ca77742b83f297360a321aa376433ab992e3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2007</creationdate><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Bae, Dong Su</creatorcontrib><creatorcontrib>Bae, Dong Hyun</creatorcontrib><creatorcontrib>Kim, Soon Kook</creatorcontrib><creatorcontrib>Shibayama, Tamaki</creatorcontrib><creatorcontrib>Lee, Sang Ll</creatorcontrib><collection>CrossRef</collection><collection>Aluminium Industry Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Key engineering materials</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Bae, Dong Su</au><au>Bae, Dong Hyun</au><au>Kim, Soon Kook</au><au>Shibayama, Tamaki</au><au>Lee, Sang Ll</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Interface Properties of Copper/Aluminum/Stainless Steel Clad Materials</atitle><jtitle>Key engineering materials</jtitle><date>2007-08-15</date><risdate>2007</risdate><volume>345-346</volume><spage>1497</spage><epage>1500</epage><pages>1497-1500</pages><issn>1013-9826</issn><issn>1662-9795</issn><eissn>1662-9795</eissn><abstract>Copper/aluminum/stainless steel (Cu/Al/STS) clad materials were made by rolling and
heat treatment process. These specimens were evaluated the formability and bonding strength of
Cu/Al/STS clad materials. Thin disc specimens for TEM observation were prepared from the
interfaces of Cu/Al and Al/STS by using the Focused Ion Beam (FIB) utility. Brittle oxide film
formed on copper surface during heat treatment at 673K~773K. Diffusion bonding was observed at
the interface of Cu/Al. Reacted region was formed in the interface of Al/STS with width about
10nm, while in the case of Cu/Al was formed about 1,600nm width. It was also observed nanosized
crevice in reacted region of Al/STS interfaces.</abstract><pub>Trans Tech Publications Ltd</pub><doi>10.4028/www.scientific.net/KEM.345-346.1497</doi><tpages>4</tpages></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 1013-9826 |
| ispartof | Key engineering materials, 2007-08, Vol.345-346, p.1497-1500 |
| issn | 1013-9826 1662-9795 1662-9795 |
| language | eng |
| recordid | cdi_proquest_miscellaneous_30009630 |
| source | Scientific.net Journals |
| title | Interface Properties of Copper/Aluminum/Stainless Steel Clad Materials |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-20T20%3A09%3A41IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Interface%20Properties%20of%20Copper/Aluminum/Stainless%20Steel%20Clad%20Materials&rft.jtitle=Key%20engineering%20materials&rft.au=Bae,%20Dong%20Su&rft.date=2007-08-15&rft.volume=345-346&rft.spage=1497&rft.epage=1500&rft.pages=1497-1500&rft.issn=1013-9826&rft.eissn=1662-9795&rft_id=info:doi/10.4028/www.scientific.net/KEM.345-346.1497&rft_dat=%3Cproquest_cross%3E30009630%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=30009630&rft_id=info:pmid/&rfr_iscdi=true |