Mechanical deformation-induced Sn whiskers growth on electroplated films in the advanced flexible electronic packaging

In this study, we investigated mechanical deformation-induced Sn whisker growth, which is frequently encountered in advanced flexible substrate packaging. Concentrated compressive stresses are introduced around the leads and solder surface finish joints connected by compression fixing. Six types of...

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Veröffentlicht in:	Journal of materials research 2007-07, Vol.22 (7), p.1975-1986
Hauptverfasser:	Lin, Shih-kang, Yorikado, Yuhi, Jiang, Junxiang, Kim, Keun-Soo, Suganuma, Katsuaki, Chen, Sinn-wen, Tsujimoto, Masanobu, Yanada, Isamu
Format:	Artikel
Sprache:	eng
Schlagworte:	Joining Microstructure
Online-Zugang:	Volltext
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