Study of interfacial reactions in Sn–3.5Ag–3.0Bi and Sn–8.0Zn–3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate

In this paper, the coupling effect in Sn–3.5Ag–3.0Bi and Sn–8.0Zn–3.0Bi solder joint with sandwich structure by long time reflow soldering was studied. It was found that the interfacial compound at the Cu substrate was binary Cu–Sn compound in Sn–Ag–Bi solder joint and Cu 5Zn 8 phase in Sn–Zn–Bi sol...

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Veröffentlicht in:	Journal of alloys and compounds 2007-06, Vol.437 (1), p.169-179
Hauptverfasser:	Sun, Peng, Andersson, Cristina, Wei, Xicheng, Cheng, Zhaonian, Shangguan, Dongkai, Liu, Johan
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Brazing. Soldering Cu diffusion Exact sciences and technology Interfacial reaction Intermetallic compound (IMC) Joining, thermal cutting: metallurgical aspects Lead-free solder Metals. Metallurgy
Online-Zugang:	Volltext
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