The effect of reflow profile on SnPb and SnAgCu solder joint shear strength

Purpose - The purpose of this work is to study the effect of the reflow peak temperature and time above liquidus on both SnPb and SnAgCu solder joint shear strength.Design methodology approach - Nine reflow profiles for Sn3.0Ag0.5Cu and nine reflow profiles for Sn37Pb have been developed with three...

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Veröffentlicht in:	Soldering & surface mount technology 2006-10, Vol.18 (4), p.48-56
Hauptverfasser:	Pan, Jianbiao, Toleno, Brian J, Chou, Tzu-Chien, Dee, Wesley J
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Cooling Design. Technologies. Operation analysis. Testing Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Electronics industry Exact sciences and technology Experiments Fracture Fractures Heat treating Instruments, apparatus, components and techniques common to several branches of physics and astronomy Integrated circuits Intermetallic compounds Microelectronic fabrication (materials and surfaces technology) Microscopy Physics Scanning electron microscopy Scanning probe microscopes, components and techniques Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Shear strength Shear tests Soldering Studies Temperature Temperature effects
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