Performance characteristics of planar ion-implantation isolated heterojunction, near-infrared, and short-wave infrared hgcdte devices

Two-dimensional near-infrared (NIR) and short-wave infrared (SWIR) HgCdTe arrays have been produced using planar ion-implantation isolated heterojunction (PI3H) device technology. This paper is an extension of an earlier study in which focal plane arrays (FPAs) were fabricated based on heterojunctio...

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Veröffentlicht in:Journal of electronic materials 2004-06, Vol.33 (6), p.615-620
Hauptverfasser: TERTERIAN, S, CHU, M, MESROPIAN, S, GURGENIAN, H, BENSON, J. D, DINAN, J. H
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container_end_page 620
container_issue 6
container_start_page 615
container_title Journal of electronic materials
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creator TERTERIAN, S
CHU, M
MESROPIAN, S
GURGENIAN, H
BENSON, J. D
DINAN, J. H
description Two-dimensional near-infrared (NIR) and short-wave infrared (SWIR) HgCdTe arrays have been produced using planar ion-implantation isolated heterojunction (PI3H) device technology. This paper is an extension of an earlier study in which focal plane arrays (FPAs) were fabricated based on heterojunction-mesa and ion-implanted planar device structures. The PI3H device structure is pursued in order to verify whether it can encompass both the superb multilayer characteristics of heterojunction detectors as well as the planar integrity of ion-implanted devices. The PI3H devices are characterized, and R^sub 0^A measurements are carried out at different temperatures and compared to those obtained from heterojunction-mesa and ion-implanted device structures. Data shows the PI3H devices to be superior to both heterojunction-mesa and ion-implanted detectors at temperatures between 130 K and 300 K. Performance characteristics of the thermoelectric (TE) cooled SWIR FPAs with 320 × 256 format, as well as NIR FPAs with 640 × 512 format based on the PI3H device structure are also discussed. [PUBLICATION ABSTRACT] Key words: HgCdTe, CdZnTe, focal plane array (FPA), near infrared (NIR), short-wave infrared (SWIR), infrared detectors
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D</creatorcontrib><creatorcontrib>DINAN, J. H</creatorcontrib><title>Performance characteristics of planar ion-implantation isolated heterojunction, near-infrared, and short-wave infrared hgcdte devices</title><title>Journal of electronic materials</title><description>Two-dimensional near-infrared (NIR) and short-wave infrared (SWIR) HgCdTe arrays have been produced using planar ion-implantation isolated heterojunction (PI3H) device technology. This paper is an extension of an earlier study in which focal plane arrays (FPAs) were fabricated based on heterojunction-mesa and ion-implanted planar device structures. The PI3H device structure is pursued in order to verify whether it can encompass both the superb multilayer characteristics of heterojunction detectors as well as the planar integrity of ion-implanted devices. 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D</au><au>DINAN, J. H</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Performance characteristics of planar ion-implantation isolated heterojunction, near-infrared, and short-wave infrared hgcdte devices</atitle><jtitle>Journal of electronic materials</jtitle><date>2004-06-01</date><risdate>2004</risdate><volume>33</volume><issue>6</issue><spage>615</spage><epage>620</epage><pages>615-620</pages><issn>0361-5235</issn><eissn>1543-186X</eissn><coden>JECMA5</coden><abstract>Two-dimensional near-infrared (NIR) and short-wave infrared (SWIR) HgCdTe arrays have been produced using planar ion-implantation isolated heterojunction (PI3H) device technology. This paper is an extension of an earlier study in which focal plane arrays (FPAs) were fabricated based on heterojunction-mesa and ion-implanted planar device structures. The PI3H device structure is pursued in order to verify whether it can encompass both the superb multilayer characteristics of heterojunction detectors as well as the planar integrity of ion-implanted devices. The PI3H devices are characterized, and R^sub 0^A measurements are carried out at different temperatures and compared to those obtained from heterojunction-mesa and ion-implanted device structures. Data shows the PI3H devices to be superior to both heterojunction-mesa and ion-implanted detectors at temperatures between 130 K and 300 K. Performance characteristics of the thermoelectric (TE) cooled SWIR FPAs with 320 × 256 format, as well as NIR FPAs with 640 × 512 format based on the PI3H device structure are also discussed. [PUBLICATION ABSTRACT] Key words: HgCdTe, CdZnTe, focal plane array (FPA), near infrared (NIR), short-wave infrared (SWIR), infrared detectors</abstract><cop>New York, NY</cop><pub>Institute of Electrical and Electronics Engineers</pub><doi>10.1007/s11664-004-0056-3</doi><tpages>6</tpages></addata></record>
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subjects Cadmium zinc telluride
Condensed matter: structure, mechanical and thermal properties
Cross-disciplinary physics: materials science
rheology
Defects and impurities in crystals
microstructure
Doping and impurity implantation in iii-v and ii-vi semiconductors
Exact sciences and technology
Growth from melts
zone melting and refining
Infrared radiation
Ion implantation
Materials science
Mercury cadmium telluride
Methods of crystal growth
physics of crystal growth
Physics
Sensors
Structure of solids and liquids
crystallography
title Performance characteristics of planar ion-implantation isolated heterojunction, near-infrared, and short-wave infrared hgcdte devices
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