ArF excimer laser micromachining of Pyrex, SiC and PZT for rapid prototyping of MEMS components

The ablation process has been characterized in the past for a number of laser sources in silicon (Si) micromachining. However, very few results can be found in the literature for excimer laser technology at 193 nm on Si and even fewer for other materials like piezoceramics (PZT) and silicon carbide...

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Veröffentlicht in:	Sensors and actuators. A. Physical. 2007-05, Vol.136 (2), p.554-563
Hauptverfasser:	Desbiens, Jean-Philippe, Masson, Patrice
Format:	Artikel
Sprache:	eng
Schlagworte:	3D microstructures Excimer laser MEMS prototyping Piezoceramics Pyrex Silicon Silicon carbide
Online-Zugang:	Volltext
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