Stress determination in strained-Si grown on ultra-thin SiGe virtual substrates
Micro-Raman spectroscopy is employed for the determination of stress in strained-Si grown on ultra-thin SiGe virtual substrates with a high degree of relaxation (70–100%) and with Ge content varied from 0.12 to 0.42. Stress, σ and strain, ɛ in the strained-Si layers are estimated from analysis of th...
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Veröffentlicht in: | Materials science & engineering. B, Solid-state materials for advanced technology Solid-state materials for advanced technology, 2006-12, Vol.135 (3), p.192-194 |
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container_title | Materials science & engineering. B, Solid-state materials for advanced technology |
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creator | Perova, T.S. Lyutovich, K. Kasper, E. Waldron, A. Oehme, M. Moore, R.A. |
description | Micro-Raman spectroscopy is employed for the determination of stress in strained-Si grown on ultra-thin SiGe virtual substrates with a high degree of relaxation (70–100%) and with Ge content varied from 0.12 to 0.42. Stress,
σ and strain,
ɛ in the strained-Si layers are estimated from analysis of the spectral shifts of the Si phonon bands registered from both the strained-Si layer and the SiGe layer, taking into account the coherence conditions. |
doi_str_mv | 10.1016/j.mseb.2006.08.002 |
format | Article |
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σ and strain,
ɛ in the strained-Si layers are estimated from analysis of the spectral shifts of the Si phonon bands registered from both the strained-Si layer and the SiGe layer, taking into account the coherence conditions.</description><subject>Epitaxial silicon</subject><subject>Germanium</subject><subject>Raman spectroscopy</subject><subject>Silicon</subject><issn>0921-5107</issn><issn>1873-4944</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2006</creationdate><recordtype>article</recordtype><recordid>eNp9kMFKw0AQhhdRsFZfwFNO3hJnJmmyC16kaBUKPVTPyyaZ6JY0qbubim9vQj17Gvjn_wbmE-IWIUHA_H6X7D2XCQHkCcgEgM7EDGWRxpnKsnMxA0UYLxCKS3Hl_Q4AkIhmYrMNjr2Pag7s9rYzwfZdZLvIB2dsx3W8tdGH67-7aMyHdkzj8Dnut3bF0dG6MJg28kM59QP7a3HRmNbzzd-ci_fnp7flS7zerF6Xj-u4SlMMsalIkmKjFBaEJiWgLEcFC0UZFXmBueGyXBSKpIIaTIoNKUwblqUsUZp0Lu5Odw-u_xrYB723vuK2NR33g9ekFOSTgLmgU7FyvfeOG31wdm_cj0bQkzu905M7PbnTIPXoboQeThCPLxwtO-0ry13FtXVcBV339j_8F1dUd14</recordid><startdate>20061215</startdate><enddate>20061215</enddate><creator>Perova, T.S.</creator><creator>Lyutovich, K.</creator><creator>Kasper, E.</creator><creator>Waldron, A.</creator><creator>Oehme, M.</creator><creator>Moore, R.A.</creator><general>Elsevier B.V</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>20061215</creationdate><title>Stress determination in strained-Si grown on ultra-thin SiGe virtual substrates</title><author>Perova, T.S. ; Lyutovich, K. ; Kasper, E. ; Waldron, A. ; Oehme, M. ; Moore, R.A.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c331t-ac2829ea991721a3202461905924276716aebb5792890d0a31f2913fe8b8b18a3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2006</creationdate><topic>Epitaxial silicon</topic><topic>Germanium</topic><topic>Raman spectroscopy</topic><topic>Silicon</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Perova, T.S.</creatorcontrib><creatorcontrib>Lyutovich, K.</creatorcontrib><creatorcontrib>Kasper, E.</creatorcontrib><creatorcontrib>Waldron, A.</creatorcontrib><creatorcontrib>Oehme, M.</creatorcontrib><creatorcontrib>Moore, R.A.</creatorcontrib><collection>CrossRef</collection><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Materials science & engineering. B, Solid-state materials for advanced technology</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Perova, T.S.</au><au>Lyutovich, K.</au><au>Kasper, E.</au><au>Waldron, A.</au><au>Oehme, M.</au><au>Moore, R.A.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Stress determination in strained-Si grown on ultra-thin SiGe virtual substrates</atitle><jtitle>Materials science & engineering. B, Solid-state materials for advanced technology</jtitle><date>2006-12-15</date><risdate>2006</risdate><volume>135</volume><issue>3</issue><spage>192</spage><epage>194</epage><pages>192-194</pages><issn>0921-5107</issn><eissn>1873-4944</eissn><abstract>Micro-Raman spectroscopy is employed for the determination of stress in strained-Si grown on ultra-thin SiGe virtual substrates with a high degree of relaxation (70–100%) and with Ge content varied from 0.12 to 0.42. Stress,
σ and strain,
ɛ in the strained-Si layers are estimated from analysis of the spectral shifts of the Si phonon bands registered from both the strained-Si layer and the SiGe layer, taking into account the coherence conditions.</abstract><pub>Elsevier B.V</pub><doi>10.1016/j.mseb.2006.08.002</doi><tpages>3</tpages></addata></record> |
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subjects | Epitaxial silicon Germanium Raman spectroscopy Silicon |
title | Stress determination in strained-Si grown on ultra-thin SiGe virtual substrates |
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