Effect of AlN content on the performance of brominated epoxy resin for printed circuit board substrate

Polymer matrix composites, based on brominated epoxy, a type of material widely used in printed circuit boards (PCBs), as matrix and AlN particle as filler were prepared. The influences of AlN content on the mechanical, thermal, and electrical properties of the composites were investigated by uniaxi...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	Journal of polymer science. Part B, Polymer physics Polymer physics, 2007-07, Vol.45 (13), p.1662-1674
Hauptverfasser:	Yung, K. C., Zhu, B. L., Wu, J., Yue, T. M., Xie, C. S.
Format:	Artikel
Sprache:	eng
Schlagworte:	AlN additives Applied sciences brominated epoxy coefficient of thermal expansion Composites dielectric constant dielectric dissipation factor dynamic mechanical analysis Exact sciences and technology Forms of application and semi-finished materials glass-transition temperature halogenated resins Polymer industry, paints, wood Technology of polymers tensile strength theoretical models thermal conductivity Young's modulus
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!