Creep resistance of tin-based lead-free solder alloys

This paper reports on the microstructure-creep property relationship of three precipitation-strengthened tin (Sn)-based lead (Pb)-free solder alloys (Sn-0.7Cu, Sn-3.5Ag, and Sn-3.8Ag-0.7Cu) in bulk samples, together with Sn-37Pb as the alloy for comparison at temperatures of 303 K, 348 K, and 393 K....

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Veröffentlicht in:	Journal of electronic materials 2005-11, Vol.34 (11), p.1373-1377
Hauptverfasser:	HUANG, M. L, WU, C. M. L, WANG, L
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Condensed matter: structure, mechanical and thermal properties Creep Electronics Exact sciences and technology Lead free solders Materials Materials science Mechanical and acoustical properties of condensed matter Mechanical properties of solids Microelectronics Microstructure Physics Temperature Tin
Online-Zugang:	Volltext
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