Creep resistance of tin-based lead-free solder alloys
This paper reports on the microstructure-creep property relationship of three precipitation-strengthened tin (Sn)-based lead (Pb)-free solder alloys (Sn-0.7Cu, Sn-3.5Ag, and Sn-3.8Ag-0.7Cu) in bulk samples, together with Sn-37Pb as the alloy for comparison at temperatures of 303 K, 348 K, and 393 K....
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| Veröffentlicht in: | Journal of electronic materials 2005-11, Vol.34 (11), p.1373-1377 |
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| container_title | Journal of electronic materials |
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| creator | HUANG, M. L WU, C. M. L WANG, L |
| description | This paper reports on the microstructure-creep property relationship of three precipitation-strengthened tin (Sn)-based lead (Pb)-free solder alloys (Sn-0.7Cu, Sn-3.5Ag, and Sn-3.8Ag-0.7Cu) in bulk samples, together with Sn-37Pb as the alloy for comparison at temperatures of 303 K, 348 K, and 393 K. The creep resistance of these three Sn-based Pb-free solders increases, i.e., the steady-state creep rates decrease, with increasing volume fraction of precipitate phases for the Pb-free solder alloys. Their apparent stress exponents (n^sub a^ ~ 7.3-17), which are all higher than that of pure Sn, attain higher values with increasing volume fraction of precipitate phases at constant temperature, and with decreasing temperature for the same solder alloy. [PUBLICATION ABSTRACT] |
| doi_str_mv | 10.1007/s11664-005-0193-3 |
| format | Article |
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L ; WU, C. M. L ; WANG, L</creator><creatorcontrib>HUANG, M. L ; WU, C. M. L ; WANG, L</creatorcontrib><description>This paper reports on the microstructure-creep property relationship of three precipitation-strengthened tin (Sn)-based lead (Pb)-free solder alloys (Sn-0.7Cu, Sn-3.5Ag, and Sn-3.8Ag-0.7Cu) in bulk samples, together with Sn-37Pb as the alloy for comparison at temperatures of 303 K, 348 K, and 393 K. The creep resistance of these three Sn-based Pb-free solders increases, i.e., the steady-state creep rates decrease, with increasing volume fraction of precipitate phases for the Pb-free solder alloys. Their apparent stress exponents (n^sub a^ ~ 7.3-17), which are all higher than that of pure Sn, attain higher values with increasing volume fraction of precipitate phases at constant temperature, and with decreasing temperature for the same solder alloy. [PUBLICATION ABSTRACT]</description><identifier>ISSN: 0361-5235</identifier><identifier>EISSN: 1543-186X</identifier><identifier>DOI: 10.1007/s11664-005-0193-3</identifier><identifier>CODEN: JECMA5</identifier><language>eng</language><publisher>New York, NY: Institute of Electrical and Electronics Engineers</publisher><subject>Applied sciences ; Condensed matter: structure, mechanical and thermal properties ; Creep ; Electronics ; Exact sciences and technology ; Lead free solders ; Materials ; Materials science ; Mechanical and acoustical properties of condensed matter ; Mechanical properties of solids ; Microelectronics ; Microstructure ; Physics ; Temperature ; Tin</subject><ispartof>Journal of electronic materials, 2005-11, Vol.34 (11), p.1373-1377</ispartof><rights>2006 INIST-CNRS</rights><rights>Copyright Minerals, Metals & Materials Society Nov 2005</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c399t-3cdf843accb5e2bda052d75e23c11f5ddc6678b018393f0725316d999bf35f5f3</citedby><cites>FETCH-LOGICAL-c399t-3cdf843accb5e2bda052d75e23c11f5ddc6678b018393f0725316d999bf35f5f3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,27924,27925</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=17237854$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>HUANG, M. 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[PUBLICATION ABSTRACT]</description><subject>Applied sciences</subject><subject>Condensed matter: structure, mechanical and thermal properties</subject><subject>Creep</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Lead free solders</subject><subject>Materials</subject><subject>Materials science</subject><subject>Mechanical and acoustical properties of condensed matter</subject><subject>Mechanical properties of solids</subject><subject>Microelectronics</subject><subject>Microstructure</subject><subject>Physics</subject><subject>Temperature</subject><subject>Tin</subject><issn>0361-5235</issn><issn>1543-186X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2005</creationdate><recordtype>article</recordtype><sourceid>8G5</sourceid><sourceid>ABUWG</sourceid><sourceid>AFKRA</sourceid><sourceid>AZQEC</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><sourceid>GNUQQ</sourceid><sourceid>GUQSH</sourceid><sourceid>M2O</sourceid><recordid>eNpdkEtLAzEUhYMoWKs_wN0g6C6amzuZJEspvqDgRsFdyOQBU9JOTaYL_70pLQiu7ll853D5CLkGdg-MyYcC0HUtZUxQBhopnpAZiBYpqO7rlMwYdkAFR3FOLkpZMQYCFMyIWOQQtk0OZSiT3bjQjLGZhg3tbQm-ScF6GivSlDH5kBub0vhTLslZtKmEq-Odk8_np4_FK12-v7wtHpfUodYTReejatE614vAe2-Z4F7WiA4gCu9d10nVM1CoMTLJBULntdZ9RBFFxDm5O-xu8_i9C2Uy66G4kJLdhHFXDNdKoJaygjf_wNW4y5v6m-Gs1Vx1eg_BAXJ5LCWHaLZ5WNv8Y4CZvUVzsGiqRbO3aLB2bo_DtjibYq6OhvJXlBylqp5_ASjCcHs</recordid><startdate>20051101</startdate><enddate>20051101</enddate><creator>HUANG, M. 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L</au><au>WU, C. M. L</au><au>WANG, L</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Creep resistance of tin-based lead-free solder alloys</atitle><jtitle>Journal of electronic materials</jtitle><date>2005-11-01</date><risdate>2005</risdate><volume>34</volume><issue>11</issue><spage>1373</spage><epage>1377</epage><pages>1373-1377</pages><issn>0361-5235</issn><eissn>1543-186X</eissn><coden>JECMA5</coden><abstract>This paper reports on the microstructure-creep property relationship of three precipitation-strengthened tin (Sn)-based lead (Pb)-free solder alloys (Sn-0.7Cu, Sn-3.5Ag, and Sn-3.8Ag-0.7Cu) in bulk samples, together with Sn-37Pb as the alloy for comparison at temperatures of 303 K, 348 K, and 393 K. The creep resistance of these three Sn-based Pb-free solders increases, i.e., the steady-state creep rates decrease, with increasing volume fraction of precipitate phases for the Pb-free solder alloys. Their apparent stress exponents (n^sub a^ ~ 7.3-17), which are all higher than that of pure Sn, attain higher values with increasing volume fraction of precipitate phases at constant temperature, and with decreasing temperature for the same solder alloy. [PUBLICATION ABSTRACT]</abstract><cop>New York, NY</cop><pub>Institute of Electrical and Electronics Engineers</pub><doi>10.1007/s11664-005-0193-3</doi><tpages>5</tpages></addata></record> |
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| subjects | Applied sciences Condensed matter: structure, mechanical and thermal properties Creep Electronics Exact sciences and technology Lead free solders Materials Materials science Mechanical and acoustical properties of condensed matter Mechanical properties of solids Microelectronics Microstructure Physics Temperature Tin |
| title | Creep resistance of tin-based lead-free solder alloys |
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